CL

Chun-Te Lin

AI Acer Incorporated: 11 patents #87 of 935Top 10%
PT Powertech Technology: 8 patents #9 of 136Top 7%
MV Mosel Vitelic: 4 patents #60 of 482Top 15%
CE Compal Electronics: 2 patents #299 of 873Top 35%
IT ITRI: 1 patents #5,197 of 9,619Top 55%
IT Integrated Crystal Technology: 1 patents #4 of 19Top 25%
Overall (All Time): #142,156 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 25 most recent of 27 patents

Patent #TitleCo-InventorsDate
D1078748 Mouse pad Tsun-Chih Yang 2025-06-10
D1072975 Exercise equipment Tsun-Chih Yang 2025-04-29
D1041465 Notebook computer Wei-Chang Chen, Jung-Wei Tsao 2024-09-10
D1038114 Notebook computer Wei-Chang Chen, Jung-Wei Tsao, Ker-Wei Lin 2024-08-06
D1032583 Router Tsun-Chih Yang 2024-06-25
D1024021 Controller Tsun-Chih Yang 2024-04-23
D1022973 Antenna Tsun-Chih Yang 2024-04-16
D998278 Catholic smart rosary Tsun-Chih Yang 2023-09-05
11694950 Semiconductor package Chih-Yen Su 2023-07-04
D955383 Computer host Tsun-Chih Yang 2022-06-21
11362055 Bump structure of the semiconductor package Chih-Yen Su 2022-06-14
11302539 Semiconductor packaging structure and method for packaging semiconductor device Tsung-Han Chiang 2022-04-12
D939024 Electronic gaming cabin Tsun-Chih Yang 2021-12-21
D935399 Wireless charging stand for catholic smart rosary Tsun-Chih Yang 2021-11-09
11133291 Chip package structure with multi-chip stack Chih-Yen Su 2021-09-28
10950557 Stacked chip package structure and manufacturing method thereof Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chien-Wen Huang 2021-03-16
10607860 Package structure and chip structure Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu 2020-03-31
10276510 Manufacturing method of package structure having conductive shield Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu 2019-04-30
9825010 Stacked chip package structure and manufacturing method thereof Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chien-Wen Huang 2017-11-21
9618990 Electronic device and power management method thereof Shih-Chin Lu, Chung-Chi Tsou 2017-04-11
8531009 Package structure of three-dimensional stacking dice and method for manufacturing the same Tzu-Ying Kuo, Shu-Ming Chang 2013-09-10
8122241 Method for delivering a confidential e-mail Yi-Hung Shen 2012-02-21
7358168 Ion implantation method for forming a shallow junction Ta-Te Chen, Jen-Li Lo 2008-04-15
7344998 Wafer recovering method, wafer, and fabrication method Ta-Te Chen 2008-03-18
7192789 Method for monitoring an ion implanter Chih-Sheng Yang, Hong Zhi Lee, Ta-Te Chen 2007-03-20