Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694950 | Semiconductor package | Chun-Te Lin | 2023-07-04 |
| 11362055 | Bump structure of the semiconductor package | Chun-Te Lin | 2022-06-14 |
| 11133291 | Chip package structure with multi-chip stack | Chun-Te Lin | 2021-09-28 |