Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184266 | Electronic package structure | Chi-Sheng Tseng, Lu-Ming Lai, Kuo-Hua LAI, Hui-Chung Liu | 2024-12-31 |
| 12168605 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Chia-Hung Shen | 2024-12-17 |
| 11973048 | Semiconductor package and method for manufacturing the same | An-Nong Wen, Ching-Ho Chang | 2024-04-30 |
| 11588470 | Semiconductor package structure and method of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Kuo-Hua LAI, Hui-Chung Liu | 2023-02-21 |
| 11565934 | Semiconductor package structures and methods of manufacturing the same | Yu-Hsuan Tsai, Lu-Ming Lai, Chien-Wei Fang | 2023-01-31 |
| 11527671 | Optical package structure and method of manufacturing the same | Chi-Sheng Tseng, Hui-Chung Liu | 2022-12-13 |
| 11296651 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu, Kuo-Hua LAI, Cheng-Ling Huang | 2022-04-05 |
| 11171108 | Semiconductor package and method for manufacturing the same | An-Nong Wen, Ching-Ho Chang | 2021-11-09 |
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, An-Nong Wen, Po Ming Huang | 2021-09-28 |
| 11101189 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Yu-Hsuan Tsai | 2021-08-24 |
| 11091365 | MEMS package structure and manufacturing method thereof | Lu-Ming Lai | 2021-08-17 |
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai | 2021-08-03 |
| 11014806 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Chia-Hung Shen | 2021-05-25 |
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu-Shan Huang, Lu-Ming Lai | 2020-11-17 |
| 10812017 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu, Kuo-Hua LAI, Cheng-Ling Huang | 2020-10-20 |
| 10782184 | Optical device and method of manufacturing the same | Yu-Min Peng, Lu-Ming Lai | 2020-09-22 |
| 10689249 | Semiconductor device package including a wall and a grounding ring exposed from the wall | Hsun-Wei Chan, Lu-Ming Lai | 2020-06-23 |
| 10689248 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Yu-Hsuan Tsai | 2020-06-23 |
| 10526200 | Semiconductor device package including cover including tilted inner sidewall | Hsun-Wei Chan, Yu-Hsuan Tsai | 2020-01-07 |
| 9881845 | Electronic device, lid structure and package structure | Yung-Yi Chang, Hsun-Wei Chan | 2018-01-30 |
| 9850124 | Semiconductor device package for reducing parasitic light and method of manufacturing the same | Hsun-Wei Chan, Yu-Hsuan Tsai | 2017-12-26 |
| 8088672 | Producing a transferred layer by implanting ions through a sacrificial layer and an etching stop layer | Tien-Hsi Lee, Chao-Liang Chang, Yao-Yu Yang | 2012-01-03 |