Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, Ching-Han Huang, An-Nong Wen | 2021-09-28 |
| 9817788 | Hub devices and methods for initializing hub device | Chih-Long Ho, Yi-Te Chen, Wen-Hao Cheng, Kuo-Yu Wu, Chun-Heng Lin | 2017-11-14 |
| 9789528 | Automated forming machine | — | 2017-10-17 |
| 9511404 | Sheet molding device | — | 2016-12-06 |
| 8877319 | Multi-layer composite structure | — | 2014-11-04 |
| D698775 | Mobile phone shell | — | 2014-02-04 |