Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309275 | Sensor package structure | — | 2022-04-19 |
| 10720370 | Sensor package structure | Jian-Ru Chen, Jo-Wei Yang, Hsiu-Wen Tu | 2020-07-21 |
| 10692917 | Sensor package structure | Hsiu-Wen Tu, Jian-Ru Chen | 2020-06-23 |
| 10600830 | Sensor package structure | Jian-Ru Chen, Jo-Wei Yang, LI-CHUN HUNG, Hsiu-Wen Tu | 2020-03-24 |
| 10411055 | Sensor package structure | Chun-Hua Chuang, Wen-Chung Huang, Chen Peng, LI-CHUN HUNG | 2019-09-10 |
| 10236313 | Sensor package structure | Hsiu-Wen Tu, Jian-Ru Chen | 2019-03-19 |
| 10186538 | Sensor package structure | Hsiu-Wen Tu, Jian-Ru Chen | 2019-01-22 |
| 10170508 | Optical package structure | Hsiu-Wen Tu, Jina-Ru Chen | 2019-01-01 |
| 9905597 | Sensor package structure | Jo-Wei Yang, Ming-Hui Chen | 2018-02-27 |
| 9184331 | Method for reducing tilt of optical unit during manufacture of image sensor | Chun-Hua Chuang, Chien-Wei Chang, Chen Peng, Chun-Lung Huang, Hsiu-Wen Tu +4 more | 2015-11-10 |
| 8928104 | Image sensor packaging structure with black encapsulant | Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2015-01-06 |
| 8847146 | Image sensor package structure with casing including a vent without sealing and in communication with package material | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho +2 more | 2014-09-30 |
| 8828777 | Wafer level image sensor packaging structure and manufacturing method of the same | Hsiu-Wen Tu, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu +2 more | 2014-09-09 |
| 8563350 | Wafer level image sensor packaging structure and manufacturing method for the same | Hsiu-Wen Tu, Han-Hsing Chen, Ming-Hui Chen | 2013-10-22 |
| 8481343 | Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same | Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2013-07-09 |
| 8450137 | Method for reducing tilt of transparent window during manufacturing of image sensor | Chun-Hua Chuang, Yao-Nien Chuang, Tiao-Mu Hsu, Chien-Wei Chang, Chien-Hen Lin +1 more | 2013-05-28 |
| 8440488 | Manufacturing method and structure for wafer level image sensor module with fixed focal length | Hsiu-Wen Tu, Han-Hsing Chen, Ming-Hui Chen | 2013-05-14 |
| 8441086 | Image sensor packaging structure with predetermined focal length | Hsiu-Wen Tu, Chun-Hua Chuang, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao | 2013-05-14 |
| 8390087 | Image sensor package structure with large air cavity | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon-Nam Ho +2 more | 2013-03-05 |
| 8378441 | Manufacturing method and structure of a wafer level image sensor module with package structure | Hsiu-Wen Tu, Han-Hsing Chen, Ming-Hui Chen, Ren-Long Kuo, Chih-Cheng Hsu +2 more | 2013-02-19 |
| 8314481 | Substrate structure for an image sensor package and method for manufacturing the same | Yves Huang, Kevin Chang, Chief Lin | 2012-11-20 |
| 8093674 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof | Hsiu-Wen Tu, Ren-Long Kuo, Young-Houng Shiao, Tsao-Pin Chen, Mon Ho +2 more | 2012-01-10 |
| 8004602 | Image sensor structure and integrated lens module thereof | Chun-Hua Chuang, Chen Peng, Chien-Wei Chang, Chien-Hen Lin | 2011-08-23 |
| 7598580 | Image sensor module package structure with supporting element | Chun-Hua Chuang, Chen Peng, Chien-Wei Chang, Chien-Hen Lin | 2009-10-06 |
| 7554599 | Image sensor module with air escape hole and a method for manufacturing the same | Hsiu-Wen Tu, Mon Ho, Jason Chuang, Chen Peng, Wei-Lin Chang | 2009-06-30 |