| 11869919 |
Method for manufacturing a sensor device with a buried deep trench structure and sensor device |
Magali Glemet, Henning Feick, Dirk Offenberg |
2024-01-09 |
| 11393714 |
Producing a buried cavity in a semiconductor substrate |
Andre Roeth, Thoralf Kautzsch, Uwe Rudolph, Maik Stegemann, Mirko Vogt |
2022-07-19 |
| 10060816 |
Sensor structures, systems and methods with improved integration and optimized footprint |
Thoralf Kautzsch, Heiko Froehlich, Mirko Vogt, Maik Stegemann, Andre Roeth +1 more |
2018-08-28 |
| 9752943 |
Sensor structures, systems and methods with improved integration and optimized footprint |
Thoralf Kautzsch, Heiko Froehlich, Mirko Vogt, Maik Stegemann, Andre Röth +1 more |
2017-09-05 |
| 9546923 |
Sensor structures, systems and methods with improved integration and optimized footprint |
Thoralf Kautzsch, Heiko Fröhlich, Mirko Vogt, Maik Stegemann, Andre Röth +1 more |
2017-01-17 |
| 9527725 |
Semiconductor structure with lamella defined by singulation trench |
Bernd Foeste, Thoralf Kautzsch, Stefan Kolb, Marco Mueller |
2016-12-27 |
| 9382111 |
Micromechanical system and method for manufacturing a micromechanical system |
Thoralf Kautzsch, Heiko Froehlich, Mirko Vogt, Maik Stegemann, Steffen Bieselt |
2016-07-05 |
| 9376314 |
Method for manufacturing a micromechanical system |
Thoralf Kautzsch, Heiko Froehlich, Mirko Vogt, Maik Stegemann |
2016-06-28 |
| 9236241 |
Wafer, a method for processing a wafer, and a method for processing a carrier |
Thoralf Kautzsch, Alessia Scire, Steffen Bieselt, Uwe Rudolph, Marco Mueller |
2016-01-12 |
| 8994127 |
Method of fabricating isolating semiconductor structures using a layout of trenches and openings |
Thoralf Kautzsch, Torsten Helm, Stefan Kolb, Marc Probst, Uwe Rudolph |
2015-03-31 |
| 8921954 |
Method of providing a semiconductor structure with forming a sacrificial structure |
Thoralf Kautzsch, Stefan Kolb, Bernd Foeste, Marco Mueller |
2014-12-30 |
| 8921974 |
Semiconductor manufacturing and semiconductor device with semiconductor structure |
Thoralf Kautzsch, Uwe Rudolph, Frank Hoffman |
2014-12-30 |
| 8723276 |
Semiconductor structure with lamella defined by singulation trench |
Bernd Foeste, Thoralf Kautzsch, Stefan Kolb, Marco Mueller |
2014-05-13 |
| 8627720 |
Acceleration sensor |
Thoralf Kautzsch, Bernhard Winkler, Dirk Meinhold, Ben Rosam, Bernd Foeste +1 more |
2014-01-14 |
| 8518732 |
Method of providing a semiconductor structure with forming a sacrificial structure |
Thoralf Kautzsch, Stefan Kolb, Bernd Foeste, Marco Mueller |
2013-08-27 |
| 8481400 |
Semiconductor manufacturing and semiconductor device with semiconductor structure |
Thoralf Kautzsch, Frank Hoffmann, Uwe Rudolph |
2013-07-09 |
| 8266962 |
Acceleration sensor |
Thoralf Kautzsch, Bernhard Winkler, Dirk Meinhold, Ben Rosam, Bernd Foeste +1 more |
2012-09-18 |
| 7832279 |
Semiconductor device including a pressure sensor |
Thoralf Kautzsch, Dirk Meinhold, Ben Rosam, Bernd Foeste, Andreas Thamm |
2010-11-16 |
