| 9312226 |
Semiconductor device having an identification mark |
Stefan Martens, Mathias Vaupel, Raimund Peichl |
2016-04-12 |
| 9236290 |
Method for producing a semiconductor device |
Carsten Ahrens, Rudolf Berger, Manfred Frank, Uwe Hoeckele, Bernhard Knott +4 more |
2016-01-12 |
| 8753982 |
Method for producing a connection region on a side wall of a semiconductor body |
Carsten Ahrens, Stefan Willkofer |
2014-06-17 |
| 8637967 |
Method for fabricating a semiconductor chip and semiconductor chip |
Markus Menath, Hermann Wendt |
2014-01-28 |
| 8163629 |
Metallization for chip scale packages in wafer level packaging |
Carsten Ahrens |
2012-04-24 |
| 7825510 |
Method for filling a contact hole and integrated circuit arrangement with contact hole |
Jurgen Forster, Klemens PRÜGL |
2010-11-02 |
| 7816791 |
Bonding pad for contacting a device |
Carsten Ahrens, Sven Albers, Klaus Gnannt, Ulrich Krumbein, Gunther Mackh +2 more |
2010-10-19 |
| 7660175 |
Integrated circuit, method for acquiring data and measurement system |
Dieter Kohlert, Erhard Sixt, Rainer Holmer, Georg Seidemann, Gunther Mackh +4 more |
2010-02-09 |
| 7390737 |
Method for filling a contact hole and integrated circuit arrangement with contact hole |
Jurgen Forster, Klemens PRÜGL |
2008-06-24 |
