Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8324725 | Stacked die module | Igor Y. Khandros, Charles A. Miller, Bruce Barbara | 2012-12-04 |
| 7659736 | Mechanically reconfigurable vertical tester interface for IC probing | Benjamin N. Eldridge, Makarand Shinde, Gaetan L. Mathieu, A. Nicholas Sporck | 2010-02-09 |
| 7338843 | Method for producing an electronic component, especially a memory chip | Harry Hedler, Roland Irsigler | 2008-03-04 |
| 7230437 | Mechanically reconfigurable vertical tester interface for IC probing | Benjamin N. Eldridge, Makarand Shinde, Gaetan L. Mathieu, A. Nicholas Sporck | 2007-06-12 |
| 7211451 | Process for producing a component module | Thorsten Meyer, Gerd Frankowsky, Harry Hedler, Roland Irsigler | 2007-05-01 |
| 7176131 | Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same | Georg Meyer-Berg | 2007-02-13 |
| 7087512 | Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions | Harry Hedler, Roland Irsigler, Thorsten Meyer | 2006-08-08 |
| 7074696 | Semiconductor circuit module and method for fabricating semiconductor circuit modules | Gerd Frankowsky, Harry Hedler | 2006-07-11 |
| 6953708 | Method of producing a semiconductor component having a compliant buffer layer | Harry Hedler, Thorsten Meyer | 2005-10-11 |
| 6919232 | Process for producing a semiconductor chip | Harry Hedler, Roland Irsigler | 2005-07-19 |
| 6916185 | Connection of integrated circuit to a substrate | Harry Hedler | 2005-07-12 |
| 6905954 | Method for producing a semiconductor device and corresponding semiconductor device | Harry Hedler, Thorsten Meyer | 2005-06-14 |
| 6888256 | Compliant relief wafer level packaging | Harry Hedler, Thorsten Meyer | 2005-05-03 |
| 6861291 | Method producing a contact connection between a semiconductor chip and a substrate and the contact connection | Harry Hedler, Roland Irsigler | 2005-03-01 |
| 6845554 | Method for connection of circuit units | Gerd Frankowsky, Harry Hedler, Roland Irsigler, Thorsten Meyer | 2005-01-25 |
| 6826037 | Electronic structure | Harry Hedler, Thorsten Meyer | 2004-11-30 |
| 6756540 | Self-adhering chip | Harry Hedler | 2004-06-29 |
| 6744127 | Semiconductor chip, memory module and method for testing the semiconductor chip | Harry Hedler, Jochen Müller | 2004-06-01 |
| 6727576 | Transfer wafer level packaging | Harry Hedler, Thorsten Meyer | 2004-04-27 |
| 6714418 | Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another | Gerd Frankowsky, Harry Hedler, Roland Irsigler, Thorsten Meyer | 2004-03-30 |
| 6709953 | Method of applying a bottom surface protective coating to a wafer, and wafer dicing method | David Wallis, Sylvia Baumann Winter | 2004-03-23 |
| 6707746 | Fuse programmable I/O organization | Gerd Frankowsky | 2004-03-16 |
| 6664176 | Method of making pad-rerouting for integrated circuit chips | Harry Hedler, Thorsten Meyer, Stefan Ruckmich | 2003-12-16 |
| 6638870 | Forming a structure on a wafer | Axel Brintzinger, Harry Hedler | 2003-10-28 |
| 6521512 | Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit | — | 2003-02-18 |