Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2003-07-15 |
| 6590290 | Stacked via in copper/polyimide BEOL | John Cronin | 2003-07-08 |
| 6261951 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Leena Paivikki Buchwalter, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2001-07-17 |
| 6255217 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Paul D. Agnello, Leena Paivikki Buchwalter, John P. Hummel, Anthony K. Stamper | 2001-07-03 |
| 6143640 | Method of fabricating a stacked via in copper/polyimide beol | John Cronin | 2000-11-07 |
| 5861658 | Inorganic seal for encapsulation of an organic layer and method for making the same | John Cronin | 1999-01-19 |
| 5854141 | Inorganic seal for encapsulation of an organic layer and method for making the same | John Cronin | 1998-12-29 |
| 4789648 | Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias | Melanie M. Chow, John Cronin, William L. Guthrie, Carter W. Kaanta, William J. Patrick +2 more | 1988-12-06 |