Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087671 | Overmolded microelectronic packages containing knurled flanges and methods for the production thereof | Jerry L. White, Hamdan Ismail, Frank E. Danaher, David J. Dougherty, Aruna Manoharan | 2024-09-10 |
| 11343919 | Packaged electronic devices with top terminations | Fernando A. Santos, Lakshminarayan Viswanathan, Jerry L. White | 2022-05-24 |
| 10998255 | Overmolded microelectronic packages containing knurled flanges and methods for the production thereof | Jerry L. White, Hamdan Ismail, Frank E. Danaher, David J. Dougherty, Aruna Manoharan | 2021-05-04 |
| 10861774 | Internally-shielded microelectronic packages and methods for the fabrication thereof | Lakshminarayan Viswanathan, Vikas Shilimkar, Ramanujam Srinidhi Embar | 2020-12-08 |
| 10629518 | Internally-shielded microelectronic packages and methods for the fabrication thereof | Lakshminarayan Viswanathan, Vikas Shilimkar, Ramanujam Srinidhi Embar | 2020-04-21 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla | 2020-01-07 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla | 2019-08-27 |
| 10375833 | Methods of manufacturing packaged electronic devices with top terminations | Lakshminarayan Viswanathan, Fernando A. Santos, Jerry L. White | 2019-08-06 |
| 10241151 | Die crack detector and method therefor | Jose Luis Suarez, Michele L. Miera | 2019-03-26 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla | 2019-02-05 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, Fernando A. Santos, Jaynal A. Molla | 2019-02-05 |
| 10141227 | Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features | Jose Luis Suarez, Gabriela Michel Sanchez, Michele L. Miera, Flavio Hernandez Rodriguez | 2018-11-27 |
| 9986646 | Packaged electronic devices with top terminations, and methods of manufacture thereof | Lakshminarayan Viswanathan, Fernando A. Santos, Jerry L. White | 2018-05-29 |
| 9800208 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Lakshminarayan Viswanathan +1 more | 2017-10-24 |
| 9646897 | Die crack detector with integrated one-time programmable element | Michele L. Miera, Robert A. Pryor, Jose Luis Suarez | 2017-05-09 |
| 9466588 | Method and apparatus for multi-chip structure semiconductor package | Fernando A. Santos, Lakshminarayan Viswanathan | 2016-10-11 |
| 9300254 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Lakshminarayan Viswanathan +1 more | 2016-03-29 |
| 9263375 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Fernando A. Santos | 2016-02-16 |
| 9196520 | Tape release systems and methods for semiconductor dies | Michael L. Eleff, Jose Luis Suarez | 2015-11-24 |
| 9159588 | Packaged leadless semiconductor device | Fernando A. Santos, Lakshminarayan Viswanathan | 2015-10-13 |
| 9111984 | Devices and methods of operation for separating semiconductor die from adhesive tape | David F. Abdo, Michael L. Eleff | 2015-08-18 |
| 9111901 | Methods for bonding a die and a substrate | Jin-Wook Jang, Lalgudi M. Mahalingam, Lakshminarayan Viswanathan | 2015-08-18 |
| 9105599 | Semiconductor devices that include a die bonded to a substrate with a gold interface layer | Jin-Wook Jang, Lalgudi M. Mahalingam, Lakshminarayan Viswanathan | 2015-08-11 |
| 8963305 | Method and apparatus for multi-chip structure semiconductor package | Fernando A. Santos, Lakshminarayan Viswanathan | 2015-02-24 |
| 8803302 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Fernando A. Santos | 2014-08-12 |