Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9111901 | Methods for bonding a die and a substrate | Jin-Wook Jang, Audel A. Sanchez, Lakshminarayan Viswanathan | 2015-08-18 |
| 9105599 | Semiconductor devices that include a die bonded to a substrate with a gold interface layer | Jin-Wook Jang, Audel A. Sanchez, Lakshminarayan Viswanathan | 2015-08-11 |
| 8753983 | Die bonding a semiconductor device | Jin-Wook Jang, Audel A. Sanchez, Lakshminarayan Viswanathan | 2014-06-17 |