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Method for controlling local current to achieve uniform plating thickness |
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2005-05-24 |
| 6890413 |
Method and apparatus for controlling local current to achieve uniform plating thickness |
Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Blessen Samuel, Keith Kwong Hon Wong |
2005-05-10 |
| 6050758 |
Automated chamfering apparatus |
William A. Cavaliere, Francis R. Krug, Jr., Alan Piciacchio, Roger Andrew Lewin |
2000-04-18 |
| 6033289 |
Detailing and cleaning apparatus for green ceramic dry dicing process |
Glenn L. Cellier, David Scott Graboski, Keith A. Markland, Mirvan Wondracek, Alan Zollner |
2000-03-07 |
| 5871313 |
Precise self-aligning chamfer method and apparatus |
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1999-02-16 |
| 5795217 |
Stressed burnisher |
Mark J. LaPlante, Thomas E. Lombardi, David C. Long, Alan Piciacchio |
1998-08-18 |
| 5706568 |
Automated chamfering apparatus and method |
William A. Cavaliere, Francis R. Krug, Jr., Alan Piciacchio, Roger Andrew Lewin |
1998-01-13 |
| 5315749 |
Method for holding substrates |
Kenneth Furman, Robert W. Pasco |
1994-05-31 |
| 5226636 |
Holding fixture for substrates |
Kenneth Furman, Robert W. Pasco |
1993-07-13 |
| 5084071 |
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
Robert W. Pasco |
1992-01-28 |
| 4954142 |
Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
Jeffrey Carr, Lawrence D. David, William L. Guthrie, Frank B. Kaufman, William J. Patrick +2 more |
1990-09-04 |
