Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6258710 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Richard G. Smith +1 more | 2001-07-10 |
| 6069068 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Richard G. Smith +1 more | 2000-05-30 |
| 6037795 | Multiple device test layout | Ronald G. Filippi, James J. Poulin, Robert D. Raviart, Kenneth P. Rodbell, Richard G. Smith +1 more | 2000-03-14 |