Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309910 | Point of load module and heatsink therefor | John Andrew Trelford, Arturo Silva | 2025-05-20 |
| 11910517 | Point of load module and heatsink therefor | John Andrew Trelford, Arturo Silva | 2024-02-20 |
| 11792928 | Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connections | John Andrew Trelford, Robert Joseph Roessler, Jose Daniel Rogers, Arturo Silva | 2023-10-17 |
| 11770900 | Printed circuit board layout | Arturo Silva, Robert James Catalano, Robert Joseph Roessler | 2023-09-26 |
| 11769247 | Exposed pad integrated circuit package | Reynaldo Corpuz Javier, Andy Quang Tran | 2023-09-26 |
| 11490517 | Interposer printed circuit boards for power modules | John Andrew Trelford, Richard John Yeager, Thang Danh Truong | 2022-11-01 |
| 11487381 | Piezoelectric sensor apparatus | Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Terry Lee Sculley, Seung Bae Lee +1 more | 2022-11-01 |
| 11439013 | Interposer printed circuit boards for power modules | John Andrew Trelford, Richard John Yeager, Thang Danh Truong | 2022-09-06 |
| 11195269 | Exposed pad integrated circuit package | Reynaldo Corpuz Javier, Andy Quang Tran | 2021-12-07 |
| 10993325 | Interposer printed circuit boards for power modules | John Andrew Trelford, Richard John Yeager, Thang Danh Truong | 2021-04-27 |
| 10580723 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Andy Quang Tran | 2020-03-03 |
| 10366947 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Andy Quang Tran | 2019-07-30 |
| 10353503 | Integrated force sensing element | Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Terry Lee Sculley, Seung Bae Lee +1 more | 2019-07-16 |
| 9842797 | Stacked die power converter | Brian Ashley Carpenter, Christopher J. Sanzo, William Todd Harrison, Matthew David Romig | 2017-12-12 |
| 9768098 | Packaged semiconductor device having stacked attached chips overhanging the assembly pad | Reynaldo Corpuz Javier, Andy Quang Tran | 2017-09-19 |
| 9721859 | Semi-hermetic semiconductor package | Andy Quang Tran, Reynaldo Corpuz Javier | 2017-08-01 |
| 9576886 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Andy Quang Tran | 2017-02-21 |
| 9373569 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Andy Quang Tran | 2016-06-21 |
| 9219019 | Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound | Reynaldo Corpuz Javier, Andy Quang Tran | 2015-12-22 |
| 7477517 | Integrated heat spreader and exchanger | Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha | 2009-01-13 |