Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809451 | Capacitive sensing structure with embedded acoustic channels | Mei-Lin Chan, Xiang Li | 2017-11-07 |
| 9802815 | Method for MEMS structure with dual-level structural layer and acoustic port | Michael Julian Daneman, Mei-Lin Chan, Fariboz Assaderaghi, Erhan Polatkan Ata | 2017-10-31 |
| 9796580 | CMOS-MEMS-CMOS platform | Peter Smeys | 2017-10-24 |
| 9738512 | CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture | Daesung Lee, Jongwoo Shin, Jong Il Shin, Peter Smeys | 2017-08-22 |
| 9731963 | Method of increasing MEMS enclosure pressure using outgassing material | Cerina Zhang, Jongwoo Shin, Joseph Seeger | 2017-08-15 |
| 9718679 | Integrated heater for gettering or outgassing activation | — | 2017-08-01 |
| 9663349 | MEMS device with electrodes permeable to outgassing species | Jongwoo Shin, Houri Johari-Galle, Joseph Seeger | 2017-05-30 |
| 9650241 | Method for providing a MEMS device with a plurality of sealed enclosures having uneven standoff structures and MEMS device thereof | Cerina Zhang | 2017-05-16 |
| 9621975 | Systems and apparatus having top port integrated back cavity micro electro-mechanical system microphones and methods of fabrication of the same | Fang Liu | 2017-04-11 |
| 9617141 | MEMS device and process for RF and low resistance applications | Michael Julian Daneman, Xiang Li, Li-Wen Hung | 2017-04-11 |
| 9617144 | Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same | Julius Ming-Lin Tsai, Baris Cagdaser, Aleksey S. Khenkin | 2017-04-11 |
| 9611133 | Film induced interface roughening and method of producing the same | Fang Liu, Jong Il Shin, Jongwoo Shin | 2017-04-04 |
| 9556019 | Cavity pressure modification using local heating with a laser | Michael Dueweke | 2017-01-31 |
| 9540230 | Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures | Michael Julian Daneman, Kegang Huang, Igor Tchertkov | 2017-01-10 |
| 9452925 | Method of increasing MEMS enclosure pressure using outgassing material | Cerina Zhang, Jongwoo Shin, Joseph Seeger | 2016-09-27 |
| 9428379 | MEMS acoustic sensor with integrated back cavity | Erhan Polatkan Ata, Xiang Li, Stephen Lloyd, Michael Julian Daneman | 2016-08-30 |
| 9344808 | Differential sensing acoustic sensor | Mei-Lin Chan, Michael Julian Daneman, Erhan Polatkan Ata, Xiang Li | 2016-05-17 |
| 9302902 | Integrated heater on MEMS cap for wafer scale packaged MEMS sensors | Goksen G. Yaralioglu | 2016-04-05 |
| 9227842 | Method for MEMS structure with dual-level structural layer and acoustic port | Michael Julian Daneman, Mei-Lin Chan, Fariboz Assaderaghi, Erhan Polatkan Ata | 2016-01-05 |
| 9221676 | Internal electrical contact for enclosed MEMS devices | Kegang Huang, Jongwoo Shin, Michael Julian Daneman, Joseph Seeger | 2015-12-29 |
| 9216897 | Capacitive sensing structure with embedded acoustic channels | Mei-Lin Chan, Xiang Li | 2015-12-22 |
| 9114977 | MEMS device and process for RF and low resistance applications | Michael Julian Daneman, Xiang Li, Li-Wen Hung | 2015-08-25 |
| 9035428 | Integrated structure with bidirectional vertical actuation | Michael Julian Daneman, Li-Wen Hung, Stephen Lloyd | 2015-05-19 |
| 8945969 | Internal electrical contact for enclosed MEMS devices | Kegang Huang, Jongwoo Shin, Michael Julian Daneman, Joseph Seeger | 2015-02-03 |
| 8822252 | Internal electrical contact for enclosed MEMS devices | Kegang Huang, Jongwoo Shin, Michael Julian Daneman, Joseph Seeger | 2014-09-02 |