Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780658 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Richard H. Livengood, Gary Woods, Michael DiBattista | 2004-08-24 |
| 6621174 | Apparatus for fabricating encapsulated micro-channels in a substrate | Jeremy Rowlette | 2003-09-16 |
| 6617177 | Liquid crystal display devices having fill holes and electrical contacts on the back side of the die | — | 2003-09-09 |
| 6610605 | Method and apparatus for fabricating encapsulated micro-channels in a substrate | Jeremy Rowlette | 2003-08-26 |
| 6579732 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Richard H. Livengood, Gary Woods, Michael DiBattista | 2003-06-17 |
| 6528895 | Method and apparatus for making and using an improved fiducial for an integrated circuit | Richard H. Livengood | 2003-03-04 |
| 6525922 | High performance via capacitor and method for manufacturing same | Richard H. Livengood, Suresh Ramalingam | 2003-02-25 |
| 6495454 | Substrate interconnect for power distribution on integrated circuits | Richard H. Livengood, Valuri R. M. Rao | 2002-12-17 |
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Adam J. DeGrush, Steven P. Maher | 2002-04-23 |
| 6373572 | Method and apparatus for making and using an improved fiducial for an intergrated circuit | Richard H. Livengood | 2002-04-16 |
| 6355950 | Substrate interconnect for power distribution on integrated circuits | Richard H. Livengood, Valuri R. M. Rao | 2002-03-12 |
| 6355494 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Richard H. Livengood, Gary Woods, Michael DiBattista | 2002-03-12 |
| 6275205 | Method and apparatus for displaying information with an integrated circuit device | — | 2001-08-14 |
| 6222246 | Flip-chip having an on-chip decoupling capacitor | Tak M. Mak, Valluri Rao, Richard H. Livengood | 2001-04-24 |
| 6159753 | Method and apparatus for editing an integrated circuit | Richard H. Livengood | 2000-12-12 |
| 6159754 | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Adam J. DeGrush, Steven P. Maher | 2000-12-12 |
| 6122174 | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate | Richard H. Livengood, Valluri Rao | 2000-09-19 |
| 6001703 | Method of forming a fiducial for aligning an integrated circuit die | Richard H. Livengood | 1999-12-14 |
| 5976980 | Method and apparatus providing a mechanical probe structure in an integrated circuit die | Richard H. Livengood, Valluri Rao | 1999-11-02 |
| 5963781 | Technique for determining semiconductor substrate thickness | — | 1999-10-05 |
| 5952247 | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate | Richard H. Livengood, Valluri Rao | 1999-09-14 |
| 5948217 | Method and apparatus for endpointing while milling an integrated circuit | Richard H. Livengood | 1999-09-07 |
| 5942805 | Fiducial for aligning an integrated circuit die | Richard H. Livengood | 1999-08-24 |
| 5923086 | Apparatus for cooling a semiconductor die | Mario Paniccia, Karl Jiefu Ma | 1999-07-13 |
| 5854804 | Method and apparatus for synchronizing a mode locked laser with a device under test | Mario Paniccia | 1998-12-29 |