Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7232526 | Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing | Paul Winer, Gary Woods, Michael DiBattista | 2007-06-19 |
| 7205566 | Transistor-level signal cutting method and structure | Darren Slawecki | 2007-04-17 |
| 7183122 | Physical nano-machining with a scanning probe system for integrated circuit modification | Michael DiBattista, Elizabeth B. Varner, Randall C. White | 2007-02-27 |
| 7141439 | Transistor-level signal cutting method and structure | Darren Slawecki | 2006-11-28 |
| 6855946 | Fiducial transistor in an integrated circuit | Steve Seidel, Simon Tam, Valluri Rao, Stefan Rusu | 2005-02-15 |
| 6825557 | Localized backside chip cooling with integrated smart valves | Michael DiBattista | 2004-11-30 |
| 6780658 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Paul Winer, Gary Woods, Michael DiBattista | 2004-08-24 |
| 6753541 | Method and apparatus for making and using a beacon fiducial for an integrated circuit | Steve Seidel, Simon Tam, Valluri Rao, Stefan Rusu | 2004-06-22 |
| 6579732 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Paul Winer, Gary Woods, Michael DiBattista | 2003-06-17 |
| 6528895 | Method and apparatus for making and using an improved fiducial for an integrated circuit | Paul Winer | 2003-03-04 |
| 6525922 | High performance via capacitor and method for manufacturing same | Paul Winer, Suresh Ramalingam | 2003-02-25 |
| 6495454 | Substrate interconnect for power distribution on integrated circuits | Paul Winer, Valuri R. M. Rao | 2002-12-17 |
| 6448168 | Method for distributing a clock on the silicon backside of an integrated circuit | Valluri Rao, Jeffrey K. Greason | 2002-09-10 |
| 6373572 | Method and apparatus for making and using an improved fiducial for an intergrated circuit | Paul Winer | 2002-04-16 |
| 6355950 | Substrate interconnect for power distribution on integrated circuits | Paul Winer, Valuri R. M. Rao | 2002-03-12 |
| 6355494 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Paul Winer, Gary Woods, Michael DiBattista | 2002-03-12 |
| 6316981 | Signal distribution network on backside of substrate | Valluri Rao, Jeffrey K. Greason | 2001-11-13 |
| 6309897 | Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die | — | 2001-10-30 |
| 6222246 | Flip-chip having an on-chip decoupling capacitor | Tak M. Mak, Paul Winer, Valluri Rao | 2001-04-24 |
| 6159753 | Method and apparatus for editing an integrated circuit | Paul Winer | 2000-12-12 |
| 6153891 | Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die | — | 2000-11-28 |
| 6150718 | Method and apparatus for performing a circuit edit through the back side of an integrated circuit die | Valluri Rao, Jeffrey K. Greason | 2000-11-21 |
| 6122174 | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate | Paul Winer, Valluri Rao | 2000-09-19 |
| 6037822 | Method and apparatus for distributing a clock on the silicon backside of an integrated circuit | Valluri Rao, Jeffrey K. Greason | 2000-03-14 |
| 6020746 | Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die | — | 2000-02-01 |