Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652060 | Die interconnection scheme for providing a high yielding process for high performance microprocessors | Wilfred Gomes, Mark Bohr, Rajabali M. Koduri, Altug Koker, Swaminathan Sivakumar | 2023-05-16 |
| 11127712 | Functionally redundant semiconductor dies and package | Wilfred Gomes, Mark Bohr, Udi Sherel, Nevine Nassif, Wesley McCullough | 2021-09-21 |