Ebony L. Mays — 12 Patents at Intel

Ebony L. Mays has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2004 and the most recent in May 2025. Ebony L. Mays ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Ebony L. Mays in Hillsboro, OR, US.

Patents per Year

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12300533	Filling openings by combining non-flowable and flowable processes	Bruce J. Tufts	2025-05-13
12284826	Fin end plug structures for advanced integrated circuit structure fabrication	Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more	2025-04-22
11990364	Filling openings by combining non-flowable and flowable processes	Bruce J. Tufts	2024-05-21	$18,840,000
11978657	Filling openings by combining non-flowable and flowable processes	Bruce J. Tufts	2024-05-07	$26,756,000
11961838	Fin end plug structures for advanced integrated circuit structure fabrication	Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more	2024-04-16	$37,256,000
11380683	Fin end plug structures for advanced integrated circuit structure fabrication	Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more	2022-07-05	$18,093,000
10964800	Semiconductor device having fin-end stress-inducing features	Byron Ho, Michael L. Hattendorf, Jeanne Luce, Erica J. Thompson	2021-03-30	$32,599,000
10861850	Fin end plug structures for advanced integrated circuit structure fabrication	Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more	2020-12-08	$30,873,000
10811251	Dielectric gap-fill material deposition	Jeanne Luce, Aravind S. Killampalli, Jay P. Gupta	2020-10-20	$43,271,000
10734379	Fin end plug structures for advanced integrated circuit structure fabrication	Byron Ho, Chun-Kuo HUANG, Erica J. Thompson, Jeanne Luce, Michael L. Hattendorf +1 more	2020-08-04	$32,661,000
7098476	Multilayer interconnect structure containing air gaps and method for making	Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more	2006-08-29	$3,832,000
6815329	Multilayer interconnect structure containing air gaps and method for making	Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more	2004-11-09	$4,707,000

Ebony L. Mays — 12 Patents

Patents per Year

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