Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809130 | Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same | Kuo-Chan Chiou, Feng-Po Tseng, Lu-Shih Liao, Jia Huang, Tzu-Ting Lin | 2004-10-26 |
| 6627684 | Dielectric compositions having two steps of laminating temperatures | Hsun-Tien Li, Kai-Chi Chen, Mei-Ling Chen | 2003-09-30 |
| 5602213 | Heat resistant composition bismaleimide-modified polyurethane | Sheng-Yaw Hsu, Jing-Pin Pan | 1997-02-11 |
| 5514747 | Polyamide-imide-modified polyurethane insulation enamel composition | Sheng-Yaw Hsu | 1996-05-07 |
| 5470936 | Process for preparing high-adhesion and high-solubility poly (amide-imide-ester) | Chien-Hui Li, Han-Lung Chen | 1995-11-28 |
| RE34768 | Hydantoin or barbituric acid-extended epoxy resin composition | Ker-Min Chen | 1994-10-25 |
| 5349039 | Soluble polyesterimide | Chien-Hui Li, Jyh-Chien Chen | 1994-09-20 |
| 5342736 | Method of wet etching of polyimide | Ker-Ming Chen, Tsung-Hsiung Wang, Shing-Shing King | 1994-08-30 |
| 5310850 | Heat resistant poly(urethane amideimide) composition and method for preparing the same | Jyh-Chien Chen, Sheng-Yaw Hsu, Jing-Pin Pan | 1994-05-10 |
| 5268432 | Heat resistant modified bismaleimide adhesive composition | Jing-Pin Pan, Tsung-Hsiung Wang, Shing-Yaw Hsu, Syh-Ming Ho | 1993-12-07 |
| 5130407 | Hydantoin or barbituric acid-extended epoxy resin | Ker-Ming Chen | 1992-07-14 |
| 5112926 | Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends | Ker-Ming Chen | 1992-05-12 |
| 5006615 | Hydantoin or barbituric acid-extended epoxy resin composition | Ker-Ming Chen | 1991-04-09 |