Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5441815 | Process for producing easily removable polyimide resin film | Chien-Hui Li | 1995-08-15 |
| 5418066 | Polyimide composition for polyimide/copper foil laminate | Han-Lung Chen, Tsung-Hsiung Wang, Jing-Pin Pan | 1995-05-23 |
| 5290909 | Polyimide composition for polyimide/copper foil laminate | Han-Lung Chen, Tsung-Hsiung Wang, Jing-Pin Pan | 1994-03-01 |
| 5268432 | Heat resistant modified bismaleimide adhesive composition | Jing-Pin Pan, Tsung-Hsiung Wang, Shing-Yaw Hsu, Tzong-Ming Lee | 1993-12-07 |
| 5217599 | Bonding of polyimide film | Ker-Ming Chen, Tsung-Hsiung Wang, Richard Ping Cheng, Aina Hung | 1993-06-08 |