Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5414059 | Low bromine-content materials for manufacturing printed circuit boards | Chuen-Chyr Chen | 1995-05-09 |
| 5342736 | Method of wet etching of polyimide | Tsung-Hsiung Wang, Shing-Shing King, Tzong-Ming Lee | 1994-08-30 |
| 5326794 | Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin | Jing-Pin Pan, Chuen-Chyr Chen, Gwo-Yuh Shiau | 1994-07-05 |
| 5217599 | Bonding of polyimide film | Syh-Ming Ho, Tsung-Hsiung Wang, Richard Ping Cheng, Aina Hung | 1993-06-08 |
| 5200474 | Polyimide adhesive composition including barbituric acid modifier | Jing-Pin Pan, Gwo-Yuh Shiau, Tsung-Hsiung Wang, Wei-Chun Chang | 1993-04-06 |
| 5130407 | Hydantoin or barbituric acid-extended epoxy resin | Tzong-Ming Lee | 1992-07-14 |
| 5112926 | Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends | Tzong-Ming Lee | 1992-05-12 |
| 5041519 | Composition comprising epoxy resin, bismaleimide and barbituric acid | Jing-Pin Pan | 1991-08-20 |
| 5006615 | Hydantoin or barbituric acid-extended epoxy resin composition | Tzong-Ming Lee | 1991-04-09 |