Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7834387 | Metal gate compatible flash memory gate stack | Deok-kee Kim, Haining Yang, Xiaojun Yu | 2010-11-16 |
| 7825479 | Electrical antifuse having a multi-thickness dielectric layer | Kangguo Cheng, Chandrasekharan Kothandaraman, Chengwen Pei, Ravi M. Todi, Xiaojun Yu | 2010-11-02 |
| 7785979 | Integrated circuits comprising resistors having different sheet resistances and methods of fabricating the same | Kangguo Cheng, Terence B. Hook | 2010-08-31 |
| 7784009 | Electrically programmable π-shaped fuse structures and design process therefore | Kangguo Cheng, Jack A. Mandelman, William R. Tonti | 2010-08-24 |
| 7759766 | Electrical fuse having a thin fuselink | MaryJane Brodsky, Kangguo Cheng, Chengwen Pei | 2010-07-20 |
| 7700466 | Tunneling effect transistor with self-aligned gate | Kangguo Cheng, Jack A. Mandelman | 2010-04-20 |
| 7692250 | Semiconductor structures integrating damascene-body FinFET's and planar devices on a common substrate and methods for forming such semiconductor structures | Jack A. Mandelman, William R. Tonti | 2010-04-06 |
| 7671394 | Embedded trench capacitor having a high-k node dielectric and a metallic inner electrode | MaryJane Brodsky, Kangguo Cheng, Chengwen Pei | 2010-03-02 |
| 7667248 | Bulk FinFET device | William Paul Hovis, Jack A. Mandelman | 2010-02-23 |
| 7659599 | Patterned silicon-on-insulator layers and methods for forming the same | Louis L. Hsu, Jack A. Mandelman, William R. Tonti | 2010-02-09 |
| 7656005 | Electrically programmable π-shaped fuse structures and methods of fabrication thereof | Kangguo Cheng, Jack A. Mandelman, William R. Tonti | 2010-02-02 |
| 7566629 | Patterned silicon-on-insulator layers and methods for forming the same | Louis L. Hsu, Jack A. Mandelman, William R. Tonti | 2009-07-28 |
| 7550773 | FinFET with top body contact | Kangguo Cheng, Jack A. Mandelman | 2009-06-23 |
| 7531388 | Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabricating thereof | William R. Tonti, Jack A. Mandelman | 2009-05-12 |
| 7525299 | Apparatus for accessing and probing the connections between a chip package and a printed circuit board | Paul Rudrud, John R. Dangler, Matthew S. Doyle, Jesse Hefner, Ankur Kanu Patel +1 more | 2009-04-28 |
| 7517764 | Bulk FinFET device | William Paul Hovis, Jack A. Mandelman | 2009-04-14 |
| 7417300 | Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabrication thereof | Jack A. Mandelman, William R. Tonti | 2008-08-26 |
| 7353130 | Method and apparatus for implementing automatic-calibration of TDR probing system | Matthew S. Doyle, Lynn Robert Landin, Thomas W. Liang, Ankur Kanu Patel | 2008-04-01 |
| 7352034 | Semiconductor structures integrating damascene-body FinFET's and planar devices on a common substrate and methods for forming such semiconductor structures | Jack A. Mandelman, William R. Tonti | 2008-04-01 |
| 7299144 | Method and apparatus for implementing automatic-calibration of TDR probing system | Matthew S. Doyle, Lynn Robert Landin, Thomas W. Liang, Ankur Kanu Patel | 2007-11-20 |
| 7288804 | Electrically programmable π-shaped fuse structures and methods of fabrication thereof | Kangguo Cheng, Jack A. Mandelman, William R. Tonti | 2007-10-30 |
| 7235875 | Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module | Matthew S. Doyle, Don A. Gilliland, Brian Edward Gregg, Lynn Robert Landin, Thomas W. Liang +2 more | 2007-06-26 |