Issued Patents All Time
Showing 276–287 of 287 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5168348 | Impingment cooled compliant heat sink | Michael J. Ellsworth, Jr., David T. Vader | 1992-12-01 |
| 5161089 | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same | Michael J. Ellsworth, Jr., Gary F. Goth, Robert E. Simons, Michael L. Zumbrunnen | 1992-11-03 |
| 4928207 | Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston | Gregory M. Chrysler, Robert E. Simons | 1990-05-22 |
| 4765397 | Immersion cooled circuit module with improved fins | Gregory M. Chrysler, Robert E. Simmons | 1988-08-23 |
| 4765400 | Circuit module with pins conducting heat from floating plate contacting heat producing device | Jeffrey Eid, Michael L. Zumbrunnen | 1988-08-23 |
| 4757370 | Circuit package cooling technique with liquid film spreading downward across package surface without separation | Dereje Agonafer, Robert E. Simons | 1988-07-12 |
| 4709754 | Heat transfer element with nucleate boiling surface and bimetallic fin formed from element | Robert E. Simons | 1987-12-01 |
| 4638858 | Composite heat transfer device with pins having wings alternately oriented for up-down flow | — | 1987-01-27 |
| 4510685 | Method of assembling magnetic pins into printed circuit boards | — | 1985-04-16 |
| 4235494 | Data processor enclosure with tambour door | James J. LaDue, Clifford I. Shelkofsky | 1980-11-25 |
| 4226281 | Thermal conduction module | — | 1980-10-07 |
| 4193445 | Conduction cooled module | Un-Pah Hwang, Robert E. Simons | 1980-03-18 |