RC

Richard C. Chu

IBM: 285 patents #80 of 70,183Top 1%
📍 Hopewell Junction, NY: #1 of 648 inventorsTop 1%
🗺 New York: #64 of 115,490 inventorsTop 1%
Overall (All Time): #1,473 of 4,157,543Top 1%
287
Patents All Time

Issued Patents All Time

Showing 226–250 of 287 patents

Patent #TitleCo-InventorsDate
6775137 Method and apparatus for combined air and liquid cooling of stacked electronics components Michael J. Ellsworth, Jr., Edward F. Furey, Roger R. Schmidt, Robert E. Simons 2004-08-10
6767766 Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication Michael J. Ellsworth, Jr., Robert E. Simons 2004-07-27
6714412 Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons 2004-03-30
6705089 Two stage cooling system employing thermoelectric modules Michael J. Ellsworth, Jr., Robert E. Simons 2004-03-16
6674642 Liquid-to-air cooling system for portable electronic and computer devices Michael J. Ellsworth, Jr., Robert E. Simons 2004-01-06
6650538 Fin heat sink and airflow tube assembly employing annular airflows, and methods of fabrication thereof Michael J. Ellsworth, Jr., Robert E. Simons 2003-11-18
6591898 Integrated heat sink system for a closed electronics container Michael J. Ellsworth, Jr., Robert E. Simons 2003-07-15
6587336 Cooling system for portable electronic and computer devices Michael J. Ellsworth, Jr., Robert E. Simons 2003-07-01
6587345 Electronic device substrate assembly with impermeable barrier and method of making Michael J. Ellsworth, Jr., Robert E. Simons, Prabjit Singh 2003-07-01
6557354 Thermoelectric-enhanced heat exchanger Michael J. Ellsworth, Jr., Robert E. Simons 2003-05-06
6548894 Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication Michael J. Ellsworth, Jr., Robert E. Simons 2003-04-15
6519151 Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof Michael J. Ellsworth, Jr., Robert E. Simons 2003-02-11
6490874 Recuperative environmental conditioning unit Michael J. Ellsworth, Jr., Robert E. Simons 2002-12-10
6489551 Electronic module with integrated thermoelectric cooling assembly Michael J. Ellsworth, Jr., Robert E. Simons 2002-12-03
6431260 Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof Dereje Agonafer, Michael J. Ellsworth, Jr., Robert E. Simons 2002-08-13
6424533 Thermoelectric-enhanced heat spreader for heat generating component of an electronic device Michael J. Ellsworth, Jr., Robert E. Simons 2002-07-23
6397618 Cooling system with auxiliary thermal buffer unit for cooling an electronics module Michael J. Ellsworth, Jr., Robert E. Simons 2002-06-04
6396700 Thermal spreader and interface assembly for heat generating component of an electronic device Michael J. Ellsworth, Jr., Robert E. Simons 2002-05-28
6366462 Electronic module with integral refrigerant evaporator assembly and control system therefore Michael J. Ellsworth, Jr., Robert E. Simons 2002-04-02
6337794 Isothermal heat sink with tiered cooling channels Dereje Agonafer, Michael J. Ellsworth, Jr., Robert E. Simons 2002-01-08
6301109 Isothermal heat sink with cross-flow openings between channels Michael J. Ellsworth, Jr., Robert E. Simons 2001-10-09
6253835 Isothermal heat sink with converging, diverging channels Michael J. Ellsworth, Jr., Robert E. Simons 2001-07-03
6223810 Extended air cooling with heat loop for dense or compact configurations of electronic components Gregory M. Chrysler 2001-05-01
6223813 Ultra high-density, high-performance heat sink Gregory M. Chrysler 2001-05-01
6213194 Hybrid cooling system for electronics module Gregory M. Chrysler 2001-04-10