Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9858776 | Tamper-respondent assembly with nonlinearity monitoring | James A. Busby | 2018-01-02 |
| 9839128 | Solder void reduction between electronic packages and printed circuit boards | — | 2017-12-05 |
| 9560737 | Electronic package with heat transfer element(s) | Michael T. Peets, Xiaojin Wei | 2017-01-31 |
| 9462703 | Solder void reduction between electronic packages and printed circuit boards | — | 2016-10-04 |
| 9426900 | Solder void reduction for component attachment to printed circuit boards | — | 2016-08-23 |
| 8961280 | Method of manufacturing a venting device for tamper resistant electronic modules | John R. Dangler, Arvind K. Sinha | 2015-02-24 |
| 8287336 | Method of manufacturing a venting device for tamper resistant electronic modules | John R. Dangler, Arvind K. Sinha | 2012-10-16 |
| 7214874 | Venting device for tamper resistant electronic modules | John R. Dangler, Arvind K. Sinha | 2007-05-08 |
| 6572009 | Passive and active heat retention device for solder fountain rework | Scott Peter Graves | 2003-06-03 |
| 6343732 | Passive and active heat retention device for solder fountain rework | Scott Peter Graves | 2002-02-05 |
| 6302596 | Small form factor optoelectronic transceivers | Mitchell S. Cohen, David Peter Gaio, William K. Hogan, Patrick E. McKnite, Miles Frank Swain +1 more | 2001-10-16 |
| 6300578 | Pad-on-via assembly technique | Mark K. Hoffmeyer | 2001-10-09 |
| 6261404 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, James D. Bielick, Michael L. Zumbrunnen | 2001-07-17 |
| 6127204 | Column grid array or ball grid array pad on via | Miles Frank Swain, Connie Jean Mathison | 2000-10-03 |
| 6076726 | Pad-on-via assembly technique | Mark K. Hoffmeyer | 2000-06-20 |
| 5905636 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, James D. Bielick, Michael L. Zumbrunnen | 1999-05-18 |
| 5873512 | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | James D. Bielick, Mark K. Hoffmeyer, Thomas D. Kidd, David Allen Sluzewski | 1999-02-23 |
| 5861663 | Column grid array or ball grid array pad on via | Miles Frank Swain, Connie Jean Mathison | 1999-01-19 |
| 5806753 | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | James D. Bielick, Mark K. Hoffmeyer, Thomas D. Kidd, David Allen Sluzewski | 1998-09-15 |
| 5789930 | Apparatus and method to test for known good die | David Allen Sluzewski, Mark K. Hoffmeyer | 1998-08-04 |
| 5745344 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, James D. Bielick, Michael L. Zumbrunnen | 1998-04-28 |
| 5651493 | Method of performing solder joint analysis of semi-conductor components | James D. Bielick, Mark K. Hoffmeyer | 1997-07-29 |
| 5557503 | Circuit card having a large module strain relief and heat sink support | Miles Frank Swain | 1996-09-17 |
| 5446960 | Alignment apparatus and method for placing modules on a circuit board | Thomas D. Kidd, Bradley H. Redfield, Jeffrey Stone | 1995-09-05 |
| 5275330 | Solder ball connect pad-on-via assembly process | Gregg A. Knotts, Miles Frank Swain, Burton A. Towne | 1994-01-04 |