Issued Patents All Time
Showing 176–200 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8649177 | Method of fabricating a cooled electronic system | Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Vinod Kamath, Bejoy J. Kochuparambil +4 more | 2014-02-11 |
| 8636406 | Apparatus for thermal characterization under non-uniform heat load | Hendrik F. Hamann, James A. Lacey, Roger R. Schmidt | 2014-01-28 |
| 8619425 | Multi-fluid, two-phase immersion-cooling of electronic component(s) | Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-12-31 |
| 8593815 | Techniques for data center cooling | Alan Claassen, Hendrik F. Hamann, James A. Lacey, Yves Martin, Roger R. Schmidt +1 more | 2013-11-26 |
| 8591625 | Server rack front door with contamination filter and sensor | Roger R. Schmidt, Prabjit Singh | 2013-11-26 |
| 8583290 | Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-11-12 |
| 8547692 | Heatsink allowing in-situ maintenance in a stackable module | Wael R. El-Essawy, Elmootazbellah Nabil Elnozahy, Thomas Walter Keller, Juan C. Rubio | 2013-10-01 |
| 8531839 | Liquid cooled data center with alternating coolant supply lines | Roger R. Schmidt | 2013-09-10 |
| 8505617 | Structure and apparatus for cooling integrated circuits using copper microchannels | Raschid J. Bezama, Evan G. Colgan, John Harold Magerlein, Roger R. Schmidt | 2013-08-13 |
| 8490679 | Condenser fin structures facilitating vapor condensation cooling of coolant | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-07-23 |
| 8493738 | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails | Timothy J. Chainer, Michael A. Gaynes, David P. Graybill, Vinod Kamath, Bejoy J. Kochuparambil +4 more | 2013-07-23 |
| 8472182 | Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-06-25 |
| 8457938 | Apparatus and method for simulating one or more operational characteristics of an electronics rack | Matthew R. Archibald, Hendrik F. Hamann, Roger R. Schmidt | 2013-06-04 |
| 8439561 | Fluid distribution apparatus and method facilitating cooling of electronics rack(s) and simulating heated airflow exhaust of electronics rack(s) | Matthew R. Archibald, Richard C. Chu, Hendrik F. Hamann, Roger R. Schmidt | 2013-05-14 |
| 8387249 | Apparatus and method for facilitating servicing of a liquid-cooled electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Prabjit Singh | 2013-03-05 |
| 8385069 | Liquid coolant conduit secured in an unused socket for memory module cooling | Vinod Kamath, Howard Victor Mahaney, Jr., Mark E. Steinke, Aparna Vallury | 2013-02-26 |
| 8369091 | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-02-05 |
| 8358503 | Stackable module for energy-efficient computing systems | John B. Carter, Wael R. El-Essawy, Elmootazbellah Nabil Elnozahy, Wesley M. Felter, Thomas Walter Keller +4 more | 2013-01-22 |
| 8351206 | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-01-08 |
| 8345423 | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2013-01-01 |
| 8322154 | Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2012-12-04 |
| 8322029 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Keith F. Fogel, Roger R. Schmidt +1 more | 2012-12-04 |
| 8306794 | Techniques for thermal modeling of data centers to improve energy efficiency | Hendrik F. Hamann, Theodore G. van Kessel | 2012-11-06 |
| 8279597 | Heatsink allowing in-situ maintenance in a stackable module | Wael R. El-Essawy, Elmootazbellah Nabil Elnozahy, Thomas Walter Keller, Juan C. Rubio | 2012-10-02 |
| 8274790 | Automatically reconfigurable liquid-cooling apparatus for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Randall G. Kemink, Robert E. Simons | 2012-09-25 |