MI

Madhusudan K. Iyengar

IBM: 272 patents #90 of 70,183Top 1%
Google: 33 patents #439 of 22,993Top 2%
LP Lenovo (Singapore) Pte.: 3 patents #202 of 1,012Top 20%
Meta: 2 patents #2,891 of 6,845Top 45%
📍 Foster City, CA: #1 of 2,058 inventorsTop 1%
🗺 California: #212 of 386,348 inventorsTop 1%
Overall (All Time): #1,167 of 4,157,543Top 1%
312
Patents All Time

Issued Patents All Time

Showing 126–150 of 312 patents

Patent #TitleCo-InventorsDate
9045995 Electronics rack with liquid-coolant-driven, electricity-generating system David P. Graybill, Allan R. Hoeft, Donald W. Porter, Enrico A. Romano, Roger R. Schmidt +1 more 2015-06-02
9043035 Dynamically limiting energy consumed by cooling apparatus Timothy J. Chainer, Milnes P. David, Pritish R. Parida, Roger R. Schmidt, Mark D. Schultz 2015-05-26
9042099 Air-cooling and vapor-condensing door assembly Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-05-26
9042098 Air-cooling and vapor-condensing door assembly Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-05-26
9038406 Dehumidifying cooling apparatus and method for an electronics rack Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2015-05-26
9027360 Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system Timothy J. Chainer, David P. Graybill, Vinod Kamath, Bejoy J. Kochuparambil, Roger R. Schmidt +1 more 2015-05-12
9013872 Dry-cooling unit with gravity-assisted coolant flow Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Robert E. Simons 2015-04-21
9009971 Wicking and coupling element(s) facilitating evaporative cooling of component(s) Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-04-21
9009968 Coolant manifold with separately rotatable manifold section(s) Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Eric J. McKeever +1 more 2015-04-21
8985847 Thermal resistance-based monitoring of cooling of an electronic component Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Robert E. Simons 2015-03-24
8966922 Air-side economizer facilitating liquid-based cooling of an electronics rack Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-03-03
8965748 Data center efficiency analyses and optimization Robert Schmidt 2015-02-24
8964391 Sectioned manifolds facilitating pumped immersion-cooling of electronic components Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-02-24
8964390 Sectioned manifolds facilitating pumped immersion-cooling of electronic components Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-02-24
8964375 Techniques for data center cooling Alan Claassen, Hendrik F. Hamann, James A. Lacey, Yves Martin, Roger R. Schmidt +1 more 2015-02-24
8955346 Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons 2015-02-17
8953320 Coolant drip facilitating partial immersion-cooling of electronic components Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-02-10
8953317 Wicking vapor-condenser facilitating immersion-cooling of electronic component(s) Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Robert E. Simons 2015-02-10
8947873 Immersion-cooled and conduction-cooled electronic system Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-02-03
8941994 Vapor condenser with three-dimensional folded structure Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-01-27
8934250 Immersion-cooling of selected electronic component(s) mounted to printed circuit board Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-01-13
8925333 Thermoelectric-enhanced air and liquid cooling of an electronic system Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-01-06
8929080 Immersion-cooling of selected electronic component(s) mounted to printed circuit board Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more 2015-01-06
8919143 Air-cooling wall with slidable heat exchangers Eric A. Eckberg, David P. Graybill, Howard Victor Mahaney, Jr., Roger R. Schmidt, Kenneth R. Schneebeli 2014-12-30
8922998 Coolant manifold with separately rotatable manifold section(s) Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Eric J. McKeever +1 more 2014-12-30