Issued Patents All Time
Showing 226–250 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8020390 | Cooling infrastructure leveraging a combination of free and solar cooling | Hendrik F. Hamann, Theodore G. van Kessel | 2011-09-20 |
| 8020298 | Method of fabricating a heat exchanger with angled secondary fins extending from primary fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2011-09-20 |
| 8018720 | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-09-13 |
| 8014150 | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-09-06 |
| 8009430 | Techniques for data center cooling | Alan Claassen, Hendrik F. Hamann, James A. Lacey, Yves Martin, Roger R. Schmidt +1 more | 2011-08-30 |
| 7990709 | Apparatus and method for facilitating cooling of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-08-02 |
| 7983040 | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-07-19 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Paul A. Lauro +3 more | 2011-07-12 |
| 7979250 | Method of laying out a data center using a plurality of thermal simulators | Matthew R. Archibald, Richard C. Chu, Hendrik F. Hamann, Roger R. Schmidt | 2011-07-12 |
| 7978472 | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-07-12 |
| 7967062 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Keith E. Fogel, Roger R. Schmidt +1 more | 2011-06-28 |
| 7969736 | System for cooling memory modules | Vinod Kamath, Howard Victor Mahaney, Jr., Jason A. Matteson, Mark E. Steinke | 2011-06-28 |
| 7963119 | Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-06-21 |
| 7965509 | High performance dual-in-line memory (DIMM) array liquid cooling assembly and method | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Maurice F. Holahan, Robert E. Simons +1 more | 2011-06-21 |
| 7961475 | Apparatus and method for facilitating immersion-cooling of an electronic subsystem | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Vinod Kamath, Robert E. Simons | 2011-06-14 |
| 7950244 | Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger | Roger R. Schmidt, Howard P. Welz | 2011-05-31 |
| 7948757 | Multi-fluid cooling of an electronic device | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2011-05-24 |
| 7944694 | Liquid cooling apparatus and method for cooling blades of an electronic system chassis | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-05-17 |
| 7916483 | Open flow cold plate for liquid cooled electronic packages | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-29 |
| 7905096 | Dehumidifying and re-humidifying air cooling for an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-15 |
| 7907406 | System and method for standby mode cooling of a liquid-cooled electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-03-15 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih +2 more | 2011-03-01 |
| 7885074 | Direct jet impingement-assisted thermosyphon cooling apparatus and method | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-08 |
| 7885070 | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-08 |
| 7878007 | Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons | 2011-02-01 |