Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8975635 | Co-integration of elemental semiconductor devices and compound semiconductor devices | Tze-Chiang Chen, Cheng-Wei Cheng, Devendra K. Sadana | 2015-03-10 |
| 8946054 | Crack control for substrate separation | Stephen W. Bedell, Cheng-Wei Cheng, Devendra K. Sadana, Katherine L. Saenger | 2015-02-03 |
| 8941147 | Transistor formation using cold welding | Cheng-Wei Cheng, Shu-Jen Han, Masaharu Kobayashi, Ko-Tao Lee, Devendra K. Sadana | 2015-01-27 |
| 8937299 | III-V finFETs on silicon substrate | Anirban Basu, Cheng-Wei Cheng, Amlan Majumdar, Ryan M. Martin, Uzma Rana +2 more | 2015-01-20 |
| 8927319 | Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth | Stephen R. Forrest, Jeramy D. Zimmerman, Kyusang Lee | 2015-01-06 |
| 8927398 | Group III nitrides on nanopatterned substrates | Can Bayram, Devendra K. Sadana | 2015-01-06 |
| 8907381 | Reduced short channel effect of III-V field effect transistor via oxidizing aluminum-rich underlayer | Cheng-Wei Cheng, Shu-Jen Han, Masaharu Kobayashi, Ko-Tao Lee, Devendra K. Sadana | 2014-12-09 |
| 8889541 | Reduced short channel effect of III-V field effect transistor via oxidizing aluminum-rich underlayer | Cheng-Wei Cheng, Shu-Jen Han, Masaharu Kobayashi, Ko-Tao Lee, Devendra K. Sadana | 2014-11-18 |
| 8841177 | Co-integration of elemental semiconductor devices and compound semiconductor devices | Tze-Chiang Chen, Cheng-Wei Cheng, Devendra K. Sadana | 2014-09-23 |
| 8835266 | Method and structure for compound semiconductor contact | Norma E. Sosa Cortes, Edward W. Kiewra, Masaharu Kobayashi | 2014-09-16 |
| 8828824 | III-V field effect transistory (FET) and III-V semiconductor on insulator (IIIVOI) FET, integrated circuit (IC) chip and method of manufacture | Cheng-Wei Cheng, Shu-Jen Han, Ko-Tao Lee | 2014-09-09 |
| 8822317 | Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact | Cheng-Wei Cheng, Augustin J. Hong, Jeehwan Kim, Devendra K. Sadana | 2014-09-02 |
| 8809860 | III-V compound semiconductor material passivation with crystalline interlayer | Dechao Guo, Shu-Jen Han, Edward W. Kiewra, Masaharu Kobayashi | 2014-08-19 |
| 8796120 | High throughput epitaxial lift off for flexible electronics | Cheng-Wei Cheng | 2014-08-05 |
| 8772116 | Dielectric equivalent thickness and capacitance scaling for semiconductor devices | Alessandro C. Callegari, Ko-Tao Lee, Devendra K. Sadana | 2014-07-08 |
| 8628996 | Uniformly distributed self-assembled cone-shaped pillars for high efficiency solar cells | Christos D. Dimitrakopoulos, Augustin J. Hong, Jeehwan Kim, Devendra K. Sadana | 2014-01-14 |
| 8610172 | FETs with hybrid channel materials | Dechao Guo, Shu-Jen Han, Edward W. Kiewra | 2013-12-17 |
| 8604519 | Self-aligned III-V field effect transistor (FET) and integrated circuit (IC) chip | Cheng-Wei Cheng, Shu-Jen Han | 2013-12-10 |
| 8598665 | Controlling threshold voltage in carbon based field effect transistors | Martin M. Frank, Dechao Guo, Shu-Jen Hen | 2013-12-03 |
| 8541315 | High throughput epitaxial lift off for flexible electronics | Cheng-Wei Cheng | 2013-09-24 |
| 8536043 | Reduced S/D contact resistance of III-V MOSFET using low temperature metal-induced crystallization of n+ Ge | Jeehwan Kim, Jin Hong Park, Devendra K. Sadana | 2013-09-17 |
| 8524614 | III-V compound semiconductor material passivation with crystalline interlayer | Dechao Guo, Shu-Jen Han, Edward W. Kiewra, Masaharu Kobayashi | 2013-09-03 |
| 8492187 | High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate | Cheng-Wei Cheng, Ning Li | 2013-07-23 |
| 8482033 | High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate | Cheng-Wei Cheng, Ning Li | 2013-07-09 |
| 8466493 | Self-aligned III-V field effect transistor (FET), integrated circuit (IC) chip with self-aligned III-V FETS and method of manufacture | Cheng-Wei Cheng, Shu-Jen Han | 2013-06-18 |