Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10038232 | Semiconductor wafer including an integrated waveguide for communicating signals between first and second integrated circuit dies | Bing Dang, Duixian Liu, Alberto Valdes-Garcia | 2018-07-31 |
| 10033081 | Package structure including a package substrate having an integrated waveguide coupled to first and second integrated circuits, where the package substrate is mounted to an application board | Bing Dang, Duixian Liu, Alberto Valdes-Garcia | 2018-07-24 |
| 10026752 | Stacked SOI lateral bipolar transistor RF power amplifier and driver | Alberto Valdes Garcia, Tak H. Ning, Ghavam G. Shahidi, Jeng-Bang Yau | 2018-07-17 |
| 10025029 | Integration of bonded optoelectronics, photonics waveguide and VLSI SOI | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2018-07-17 |
| 10007057 | Integration of bonded optoelectronics, photonics waveguide and VLSI SOI | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2018-06-26 |
| 10001598 | Integration of bonded optoelectronics, photonics waveguide and VLSI SOI | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2018-06-19 |
| 9977185 | Integration of bonded optoelectronics, photonics waveguide and VLSI SOI | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2018-05-22 |
| 9935089 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications | Russell A. Budd, Mounir Meghelli, Jason S. Orcutt | 2018-04-03 |
| 9935088 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications | Russell A. Budd, Mounir Meghelli, Jason S. Orcutt | 2018-04-03 |
| 9899415 | System on chip fully-depleted silicon on insulator with rf and mm-wave integrated functions | Jin Cai | 2018-02-20 |
| 9784917 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Spyridon Skordas | 2017-10-10 |
| 9786641 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications | Russell A. Budd, Mounir Meghelli, Jason S. Orcutt | 2017-10-10 |
| 9772463 | Intra chip optical interconnect structure | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2017-09-26 |
| 9742147 | Monolithic integrated photonics with lateral bipolar and BiCMOS | Jin Cai, Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2017-08-22 |
| 9716367 | Semiconductor optoelectronics and CMOS on sapphire substrate | Tymon Barwicz, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2017-07-25 |
| 9692106 | Hybrid on-chip and package antenna | Duixian Liu, Arun Natarajan, Scott K. Reynolds | 2017-06-27 |
| 9632251 | Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology | Aydin Babakhani, Steven A. Cordes, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski | 2017-04-25 |
| 9602120 | Analog to digital converter with digital reference voltage signal | Vanessa H-C Chen | 2017-03-21 |
| 9577314 | Hybrid on-chip and package antenna | Duixian Liu, Arun Natarajan, Scott K. Reynolds | 2017-02-21 |
| 9548421 | Optoelectronic devices with back contact | Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2017-01-17 |
| 9537199 | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips | Bing Dang, Duixian Liu, Alberto Valdes-Garcia | 2017-01-03 |
| 9531052 | Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit dies | Bing Dang, Duixian Liu, Alberto Valdes-Garcia | 2016-12-27 |
| 9472710 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Spyridon Skordas | 2016-10-18 |
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Bing Dang, Duixian Liu, Peter J. Sorce, Cornelia K. Tsang | 2016-10-18 |
| 9450381 | Monolithic integrated photonics with lateral bipolar and BiCMOS | Jin Cai, Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2016-09-20 |