Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9423563 | Variable buried oxide thickness for a waveguide | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2016-08-23 |
| 9395490 | Variable buried oxide thickness for a waveguide | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2016-07-19 |
| 9372307 | Monolithically integrated III-V optoelectronics with SI CMOS | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2016-06-21 |
| 9337837 | Physical unclonable function generation and management | Dirk Pfeiffer, Peilin Song | 2016-05-10 |
| 9305964 | Optoelectronic devices with back contact | Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2016-04-05 |
| 9190479 | Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another | David R. Greenberg, Alberto Valdes-Garcia | 2015-11-17 |
| 9184751 | Physical unclonable function generation and management | Dirk Pfeiffer, Peilin Song | 2015-11-10 |
| 9088278 | Physical unclonable function generation and management | Dirk Pfeiffer, Peilin Song | 2015-07-21 |
| 9059188 | Graphene resistor based tamper resistant identifier with contactless reading | Christos D. Dimitrakopoulos, Dirk Pfeiffer, Joshua T. Smith | 2015-06-16 |
| 8937355 | Striped on-chip inductor | Choongyeun Cho, Daeik Daniel Kim, Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2015-01-20 |
| 8872279 | Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another | David R. Greenberg, Alberto Valdes-Garcia | 2014-10-28 |
| 8648454 | Wafer-scale package structures with integrated antennas | Duixian Liu, Scott K. Reynolds | 2014-02-11 |
| 8350738 | Track and hold amplifiers and digital calibration for analog-to-digital converters | Mihai A. Sanduleanu, Zeynep Toprak Deniz | 2013-01-08 |
| 8227891 | Striped on-chip inductor | Choongyeun Cho, Daeik Daniel Kim, Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2012-07-24 |
| 8178908 | Electrical contact structure having multiple metal interconnect levels staggering one another | David R. Greenberg, Alberto Valdes-Garcia | 2012-05-15 |
| 7939910 | Structure for symmetrical capacitor | Choongyeun Cho, Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2011-05-10 |
| 7859825 | High yield, high density on-chip capacitor design | Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2010-12-28 |
| 7838384 | Structure for symmetrical capacitor | Choongyeun Cho, Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2010-11-23 |
| 7791160 | High-performance FET device layout | Jonghae Kim, Sungjae Lee, Scott K. Springer | 2010-09-07 |
| 7579644 | Adjustable on-chip sub-capacitor design | Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2009-08-25 |
| 7518850 | High yield, high density on-chip capacitor design | Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2009-04-14 |
| 7504705 | Striped on-chip inductor | Choongyeun Cho, Daeik Daniel Kim, Jonghae Kim, Moon J. Kim, Robert E. Trzcinski | 2009-03-17 |
| 6518903 | Analog-to-digital converter | Laurent Perraud, Mehmet Soyuer, Nicolas Sornin | 2003-02-11 |