BM

Bruno Michel

IBM: 91 patents #667 of 70,183Top 1%
EC Egypt Nanotechnology Center: 4 patents #8 of 29Top 30%
Globalfoundries: 4 patents #817 of 4,424Top 20%
HG HGST: 2 patents #738 of 1,677Top 45%
IE Itt Manufacturing Enterprises: 2 patents #359 of 1,404Top 30%
SG Snf Group: 1 patents #14 of 33Top 45%
ED Essilor International (Compagnie Generale D'Optique): 1 patents #310 of 693Top 45%
📍 Zürich, NY: #2 of 18 inventorsTop 15%
Overall (All Time): #14,521 of 4,157,543Top 1%
100
Patents All Time

Issued Patents All Time

Showing 26–50 of 100 patents

Patent #TitleCo-InventorsDate
9905505 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Kerry Bernstein, Thomas J. Brunschwiler 2018-02-27
9880595 Cooling device with nested chambers for computer hardware Thomas J. Brunschwiler, Ingmar G. Meijer, Stephan Paredes, Gerd Schlottig 2018-01-30
9855595 Solid sorption refrigeration Patrick Ruch 2018-01-02
9821418 Adsorption heat exchanger devices Thomas J. Brunschwiler, Javier V. Goicochea, Patrick Ruch 2017-11-21
9739179 Working fluid for a device, device and method for converting heat into mechanical energy Brian Burg, Stephan Paredes 2017-08-22
9630862 Desalination system and method for desalination Werner Escher, Javier V. Goicochea, Ahmed S. G. Khalil, Chin Lee Ong, Stephan Paredes 2017-04-25
9591791 System and method for cooling and delivering power to a computer system Matteo Cossale, Stephan Paredes 2017-03-07
9471089 Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network Mircea Gusat, Thomas Morf, Maria Soimu 2016-10-18
9437766 Photovoltaic thermal hybrid systems and method of operation thereof Werner Escher, Stephan Paredes, Rami Ghannam 2016-09-06
9416031 Desalination system and method for desalination Werner Escher, Javier V. Goicochea, Ahmed S. G. Khalil, Chin Lee Ong, Stephan Paredes 2016-08-16
9398730 Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium Mircea Gusat, Thomas Morf, Sebastien RAGOT, Maria Soimu 2016-07-19
9337122 Transferring heat through an optical layer of integrated circuitry Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more 2016-05-10
9304533 Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network Mircea Gusat, Thomas Morf, Maria Soimu 2016-04-05
9252072 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Kerry Bernstein, Thomas J. Brunschwiler 2016-02-02
9252071 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Kerry Bernstein, Thomas J. Brunschwiler 2016-02-02
9219183 Photovoltaic thermal hybrid solar receivers Werner Escher, Stephan Paredes, Rami Ghannam 2015-12-22
9153722 Photovoltaic module cooling devices Werner Escher, Stephan Paredes 2015-10-06
9110056 Surface treatment Sergey Amontov, Emmanuel Delamarche 2015-08-18
9064080 Transferring heat through an optical layer of integrated circuitry Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more 2015-06-23
9058461 Transferring heat through an optical layer of integrated circuitry Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more 2015-06-16
8989532 Integrated circuit package connected to an optical data transmission medium using a coolant Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more 2015-03-24
8805132 Integrated circuit package connected to a data transmission medium Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more 2014-08-12
8659898 Integrated circuit stack Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen 2014-02-25
8629554 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Kerry Bernstein, Thomas J. Brunschwiler 2014-01-14
8487427 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Kerry Bernstein, Thomas J. Brunschwiler 2013-07-16