Issued Patents All Time
Showing 51–75 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476112 | Optimized semiconductor packaging in a three-dimensional stack | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Tim Niggemeier +2 more | 2013-07-02 |
| 8453569 | Stamp with permeable hydrophylic matrix | Alexander Bietsch, Emmanuel Delamarche, Heinz Schmid, Heiko Wolf | 2013-06-04 |
| 8427833 | Thermal power plane for integrated circuits | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Tim Niggemeier +2 more | 2013-04-23 |
| 8413712 | Cooling device | Thomas J. Brunschwiler, Urs Kloter, Ryan Linderman, Hugo E. Rothuizen | 2013-04-09 |
| 8405998 | Heat sink integrated power delivery and distribution for integrated circuits | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Tim Niggemeier +2 more | 2013-03-26 |
| 8363402 | Integrated circuit stack | Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen | 2013-01-29 |
| 8336456 | Printing in a medium | Alexander Bietsch, Emmanuel Delamarche, Heinz Schmid, Heiko Wolf | 2012-12-25 |
| 8327540 | Patterned structure for a thermal interface | Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter | 2012-12-11 |
| 8267011 | Stamp with drainage channels for transferring a pattern in the presence of a third medium | Alexander Bietsch, Emmanuel Delamarche, Heinz Schmid, Heiko Wolf | 2012-09-18 |
| 8268544 | Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp | Heinz Schmid, Urs Kloter, Gerhard Keller, Jean-Paul Cano | 2012-09-18 |
| 8268563 | Method and apparatus for surface treatment | Sergey Amontov, Emmanuel Delamarche | 2012-09-18 |
| 8253234 | Optimized semiconductor packaging in a three-dimensional stack | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Tim Niggemeier +2 more | 2012-08-28 |
| 8107234 | Variable flow computer cooling system for a data center and method of operation | Thomas J. Brunschwiler, Ryan J. Linderman, Erich M. Ruetsche | 2012-01-31 |
| 8106505 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Thomas J. Brunschwiler | 2012-01-31 |
| 8049207 | Organic optoelectronic device | Siegfried F. Karg, Heike E. Riel, Walter Riess | 2011-11-01 |
| 8004832 | Variable flow computer cooling system for a data center and method of operation | Thomas J. Brunschwiler, Ryan J. Linderman, Erich M. Ruetsche | 2011-08-23 |
| 7928565 | Semiconductor device with a high thermal dissipation efficiency | Thomas J. Brunschwiler, Michel Despont, Mark A. Lantz, Peter Vettiger | 2011-04-19 |
| 7891295 | Printing in a medium | Alexander Bietsch, Emmanuel Delamarche, Heinz Schmid, Heiko Wolf | 2011-02-22 |
| 7866173 | Variable performance server system and method of operation | Thomas J. Brunschwiler, Ryan J. Linderman, Erich M. Ruetsche | 2011-01-11 |
| 7808780 | Variable flow computer cooling system for a data center and method of operation | Thomas J. Brunschwiler, Ryan J. Linderman, Erich M. Ruetsche | 2010-10-05 |
| 7748440 | Patterned structure for a thermal interface | Thomas J. Brunschwiler, Hugo E. Rothuizen, Urs Kloter | 2010-07-06 |
| 7740472 | Method and device for flowing a liquid on a surface | Emmanuel Delamarche, David Juncker, Heinz Schmid | 2010-06-22 |
| 7713789 | Semiconductor device with a high thermal dissipation efficiency | Thomas J. Brunschwiler, Michel Despont, Mark A. Lantz, Peter Vettiger | 2010-05-11 |
| 7547582 | Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies | Thomas J. Brunschwiler, Ryan J. Linderman, Urs Kloter, Hugo E. Rothuizen | 2009-06-16 |
| 7532475 | Semiconductor chip assembly with flexible metal cantilevers | Thomas J. Brunschwiler, Ryan J. Linderman, Hugo E. Rothuizen, Urs Kloter | 2009-05-12 |