AL

Alphonso P. Lanzetta

IBM: 32 patents #3,111 of 70,183Top 5%
📍 Marlboro, NY: #1 of 46 inventorsTop 3%
🗺 New York: #3,527 of 115,490 inventorsTop 4%
Overall (All Time): #108,628 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 26–33 of 33 patents

Patent #TitleCo-InventorsDate
5386344 Flex circuit card elastomeric cable connector assembly Brian S. Beaman, Fuad E. Doany, Thomas J. Dudek, Da-Yuan Shih, William J. Tkazyik +1 more 1995-01-31
5360946 Flex tape protective coating Claudius Feger, Teresita O. Graham, Kurt R. Grebe, John J. Liutkus, Linda C. Matthew +5 more 1994-11-01
5322204 Electronic substrate multiple location conductor attachment technology Mark F. Bregman, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong 1994-06-21
5268815 High density, high performance memory circuit package Thomas M. Cipolla, Paul W. Coteus, Brian C. Derdall, Christina M. Knoedler, John J. Liutkus +3 more 1993-12-07
5233221 Electronic substrate multiple location conductor attachment technology Mark F. Bregman, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong 1993-08-03
5229328 Method for bonding dielectric mounted conductors to semiconductor chip contact pads Mark F. Bregman, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong 1993-07-20
5117275 Electronic substrate multiple location conductor attachment technology Mark F. Bregman, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong 1992-05-26
5052606 Tape automated bonding feeder Thomas M. Cipolla, Raymond R. Horton, Michael J. Palmer, Mark B. Ritter 1991-10-01