Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785289 | Integrated decoupling capacitor employing conductive through-substrate vias | Michael F. McAllister, Michael J. Shapiro, Edmund J. Sprogis | 2014-07-22 |
| 8766107 | Through-hole-vias in multi-layer printed circuit boards | Moises Cases, Rohan U. Mandrekar, Nusrat I. Sherali | 2014-07-01 |
| 8658911 | Through-hole-vias in multi-layer printed circuit boards | Moises Cases, Rohan U. Mandrekar, Nusrat I. Sherali | 2014-02-25 |
| 8631706 | Noise suppressor for semiconductor packages | Nickolaus J. Gruendler, Paul M. Harvey, Sang-Yeol Lee, Michael J. Shapiro | 2014-01-21 |
| 8616987 | Cross groove type constant velocity joint | Seung Tark Oh | 2013-12-31 |
| 8568244 | Tripod constant velocity joint | Hun Hee Lee, Il Hun Ryu, Jose P. Da Silva | 2013-10-29 |
| 8569873 | Mitigation of plating stub resonance by controlling surface roughness | Bhyrav M. Mutnury, Moises Cases, Nanju Na | 2013-10-29 |
| 8558345 | Integrated decoupling capacitor employing conductive through-substrate vias | Edmund J. Sprogis, Michael F. McAllister, Michael J. Shapiro | 2013-10-15 |
| 8500566 | Cross groove type constant velocity joint | Seung Tark Oh | 2013-08-06 |
| 8495537 | Timing analysis of an array circuit cross section | Shyamkumar Thoziyoor, Sang-Yeol Lee | 2013-07-23 |
| 8488329 | Power and ground vias for power distribution systems | Sang-Yeol Lee, Nam H. Pham | 2013-07-16 |
| 8444495 | Cross groove type constant velocity joint | Seung Tark Oh | 2013-05-21 |
| 8409020 | Cross groove type constant velocity joint with composite groove patterns | Seung Tark Oh | 2013-04-02 |
| 8389870 | Coreless multi-layer circuit substrate with minimized pad capacitance | Kevin Bills, Mahesh Bohra, Jinwoo Choi, Rohan U. Mandrekar | 2013-03-05 |
| 8382600 | Cross groove type constant velocity joint with composite groove patterns | Seung Tark Oh | 2013-02-26 |
| 8288660 | Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards | — | 2012-10-16 |
| 8242384 | Through hole-vias in multi-layer printed circuit boards | Moises Cases, Rohan U. Mandrekar, Nusrat I. Sherali | 2012-08-14 |
| 8201133 | Printed circuit board with reduced signal distortion | Moises Cases, Bhyrav M. Mutnury | 2012-06-12 |
| 8110500 | Mitigation of plating stub resonance by controlling surface roughness | Bhyrav M. Mutnury, Moises Cases, Nanju Na | 2012-02-07 |
| 8096887 | Fixed type constant velocity joint | Seung Tark Oh | 2012-01-17 |
| 8083597 | Fixed type constant velocity joint | Seung Tark Oh | 2011-12-27 |
| 8060457 | Systems and methods for electromagnetic band gap structure synthesis | Ege Engin, Madhavan Swaminathan | 2011-11-15 |
| 8025575 | Constant velocity joint of tripod type | Seung Tark Oh | 2011-09-27 |
| 7452830 | Semiconductor devices and methods for manufacturing the same | Chul-Ho Shin | 2008-11-18 |
| 7289712 | Planar optical waveguide and method of fabricating the same | Jong Jun You, Hee Kyung Sung | 2007-10-30 |