Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9346040 | Organotemplate-free synthetic process for the production of a zeolitic material | Feng Xiao, Ulrich Mueller, Bilge Yilmaz | 2016-05-24 |
| 9334171 | Alkali-free synthesis of zeolitic materials of the LEV-type structure | Bilge Yilmaz, Ulrich Müller, Meike Pfaff, Hermann Gies, Feng Xiao +6 more | 2016-05-10 |
| 9114991 | Organotemplate-free synthetic process for the production of a zeolitic material of the LEV-type structure | Bilge Yilmaz, Ulrich Müller, Meike Pfaff, Feng Xiao, Haiyan Zhang | 2015-08-25 |
| 9075941 | Method for optimizing electrodeposition process of a plurality of vias in wafer | Yaofeng Sun, Xunqing Shi, Ou Dong | 2015-07-07 |
| 9032896 | Grouting and welding combined connection joint applied to a deepwater floating type platform and an offshore installation method thereof | Zhe-Wei Jiang, Wenhui Xie, Junrong Wang | 2015-05-19 |
| 9011815 | Organotemplate-free synthetic process for the production of a zeolitic material | Feng Xiao, Ulrich Mueller, Bilge Yilmaz | 2015-04-21 |
| 8865121 | Organotemplate-free synthetic process for the production of a zeolitic material | Feng Xiao, Ulrich Mueller, Bilge Yilmaz | 2014-10-21 |
| 8791578 | Through-silicon via structure with patterned surface, patterned sidewall and local isolation | Pui Chung Simon Law, Dan Yang | 2014-07-29 |
| 8754507 | Forming through-silicon-vias for multi-wafer integrated circuits | Pui Chung Simon Law, Yat Kit Tsui | 2014-06-17 |
| 8733266 | Integrative deep draft floating production platform with unconditional stability and offshore installation method thereof | Wenhui Xie, Hengyi Zeng, Wei Zhang, Junrong Wang, Zhe-Wei Jiang | 2014-05-27 |
| 8674482 | Semiconductor chip with through-silicon-via and sidewall pad | Xunqing Shi, Chang Hwa Chung | 2014-03-18 |
| 8544165 | Apparatus for aligning electronic components | Chi Kuen Vincent Leung, Xunqing Shi | 2013-10-01 |
| 8430695 | Electrical connector with waterproof function | Chien-Jen Ting | 2013-04-30 |
| 8138577 | Pulse-laser bonding method for through-silicon-via based stacking of electronic components | Xunqing Shi, Wei Ma, Chang Hwa Chung | 2012-03-20 |
| 8033870 | Electrical connector having contact terminal with cutout receiving deprressed contact arm | — | 2011-10-11 |
| 7879438 | Substrate warpage-reducing structure | Jyh-Rong Lin, Yeung Yeung, Xunqing Shi, Chang Hwa Chung | 2011-02-01 |
| 6727381 | Process for producing vitamin A ester | Runpu Shen, Shiqing Pi, Hongjun Huang | 2004-04-27 |
| 6656341 | Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching | Per Petersson, Mikael Gustavsson, Jenny Sjöberg, Bjarni Bjarnason, Gust Bierings +1 more | 2003-12-02 |