Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8544165 | Apparatus for aligning electronic components | Bin Xie, Xunqing Shi | 2013-10-01 |
| 8194411 | Electronic package with stacked modules with channels passing through metal layers of the modules | Peng SUN, Xunqing Shi, Chang Hwa Chung | 2012-06-05 |
| 8030208 | Bonding method for through-silicon-via based 3D wafer stacking | Peng SUN, Xunqing Shi, Chang Hwa Chung | 2011-10-04 |
| 7832278 | Multi-chip package | Man Lung Sham, Ziyang Gao, Lap Wai Lydia Leung, Lourdito M. Olleres, Chang Hwa Chung | 2010-11-16 |