Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495525 | Electronic module having a groove anchoring terminal pins | Shi Wo Chow | 2022-11-08 |
| 9397053 | Molded device with anti-delamination structure providing multi-layered compression forces | Yueping Ye, Man Kai Cheung | 2016-07-19 |
| 7832278 | Multi-chip package | Man Lung Sham, Ziyang Gao, Chi Kuen Vincent Leung, Lap Wai Lydia Leung, Chang Hwa Chung | 2010-11-16 |