Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551963 | Semiconductor device package and method of manufacturing the same | Ying-Chung Chen, Hsin-Ying Ho, Cheng-Ling Huang, Chang Chin Tsai | 2023-01-10 |
| 8138577 | Pulse-laser bonding method for through-silicon-via based stacking of electronic components | Xunqing Shi, Bin Xie, Chang Hwa Chung | 2012-03-20 |
| 7683459 | Bonding method for through-silicon-via based 3D wafer stacking | Xunqing Shu, Chang Hwa Chung | 2010-03-23 |