Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117715 | Wafer-level device packaging | Yat Kit Tsui, Dan Yang | 2015-08-25 |
| 8823126 | Low cost backside illuminated CMOS image sensor package with high integration | Dan Yang, Yat Kit Tsui, Shu Kin Yau | 2014-09-02 |
| 8791578 | Through-silicon via structure with patterned surface, patterned sidewall and local isolation | Bin Xie, Dan Yang | 2014-07-29 |
| 8772930 | Increased surface area electrical contacts for microelectronic packages | Dan Yang, Xunqing Shi | 2014-07-08 |
| 8754507 | Forming through-silicon-vias for multi-wafer integrated circuits | Bin Xie, Yat Kit Tsui | 2014-06-17 |
| 8212297 | High optical efficiency CMOS image sensor | Dan Yang, Xunqing Shi | 2012-07-03 |