Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9713284 | Locally enhanced direct liquid cooling system for high power applications | Ziyang Gao, Ya LV | 2017-07-18 |
| 9117715 | Wafer-level device packaging | Dan Yang, Pui Chung Simon Law | 2015-08-25 |
| 8823126 | Low cost backside illuminated CMOS image sensor package with high integration | Dan Yang, Shu Kin Yau, Pui Chung Simon Law | 2014-09-02 |
| 8754507 | Forming through-silicon-vias for multi-wafer integrated circuits | Bin Xie, Pui Chung Simon Law | 2014-06-17 |
| 8232626 | Via and method of via forming and method of via filling | Dan Yang, Xunqing Shi | 2012-07-31 |