Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312043 | Sealed high voltage direct current relay | Rongai Yu, Wenrong Song, Xiaobin Guo, Haiyan Huang, Dejin Du | 2019-06-04 |
| 10262825 | Moving iron core guide mechanism for high voltage direct current relay | Wenrong Song, Rongai Yu, Haiyan Huang, Xiaobin Guo, Dejin Du | 2019-04-16 |
| 10242941 | Apparatus, system, and method for mitigating warpage of lidless integrated circuits during reflow processes | Helen L. Turner, Marc D. Hartranft, Gautam Ganguly, Guhan Subbarayan | 2019-03-26 |
| 10163596 | Horizontal-deflection prevention mechanism for high voltage direct current relay | Wenrong Song, Rongai Yu, Xiaobin Guo, Haiyan Huang, Dejin Du | 2018-12-25 |
| D820961 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-19 |
| D820421 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-12 |
| D820420 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-12 |
| D820419 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-12 |
| D819794 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-05 |
| D819795 | Window air conditioner | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-06-05 |
| D808343 | Remote controller | Baochen Yin, Yuqiang Yao, Yaobiao Jin, Yourong Yu, Shengxin Huang | 2018-01-23 |
| 9068904 | System and method for non-contact metrology of surfaces | Robert E. Parks, Robert A. Smythe, James Burge, Roger P Angel | 2015-06-30 |
| 8623707 | Method of fabricating a semiconductor package with integrated substrate thermal slug | Andrew V. Kearney | 2014-01-07 |
| D684994 | Display screen with graphical user interface | Lun Xie | 2013-06-25 |
| 8405203 | Semiconductor package with integrated substrate thermal slug | Andrew V. Kearney | 2013-03-26 |
| 7821104 | Package device having crack arrest feature and method of forming | Chu-Chung Lee, Min Ding, Kevin J. Hess | 2010-10-26 |
| 7622309 | Mechanical integrity evaluation of low-k devices with bump shear | Scott K. Pozder, David G. Wontor, Jie Zhao | 2009-11-24 |
| 7215014 | Solderable metal finish for integrated circuit package leads and method for forming | Sheila F. Chopin, Nhat Vo | 2007-05-08 |