Issued Patents All Time
Showing 76–97 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Naotaka Tanaka +1 more | 1997-03-04 |
| 5569960 | Electronic component, electronic component assembly and electronic component unit | Tetsuo Kumazawa, Akihiro Yaguchi, Ryuji Kohno, Naotaka Tanaka, Nae Yoneda +1 more | 1996-10-29 |
| 5539250 | Plastic-molded-type semiconductor device | Asao Nishimura, Akihiro Yaguchi, Ryuji Kohno, Nae Yoneda | 1996-07-23 |
| 5530286 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 1996-06-25 |
| 5488254 | Plastic-molded-type semiconductor device | Asao Nishimura, Ichio Shimizu | 1996-01-30 |
| 5391916 | Resin sealed type semiconductor device | Ryuji Kohno, Asao Nishimura | 1995-02-21 |
| 5358904 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 1994-10-25 |
| 5357139 | Plastic encapsulated semiconductor device and lead frame | Akihiro Yaguchi, Asao Nishimura, Ryuji Kohno, Nae Yoneda, Ichiro Anjoh +1 more | 1994-10-18 |
| 5347429 | Plastic-molded-type semiconductor device | Ryuji Kohno, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda | 1994-09-13 |
| 5299092 | Plastic sealed type semiconductor apparatus | Akihiro Yaguchi, Asao Nishimura, Ichiro Anjoh, Junichi Arita | 1994-03-29 |
| 5296737 | Semiconductor device with a plurality of face to face chips | Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Gen Murakami +1 more | 1994-03-22 |
| 5295045 | Plastic-molded-type semiconductor device and producing method therefor | Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Maya Obata, Ryuji Kohno +1 more | 1994-03-15 |
| 5293068 | Semiconductor device | Ryuji Kohno, Asao Nishimura, Akihiro Yaguchi, Sueo Kawai | 1994-03-08 |
| 5256903 | Plastic encapsulated semiconductor device | Maya Obata, Asao Nishimura, Akihiro Yaguchi, Ryuji Kohno, Nae Yoneda +2 more | 1993-10-26 |
| 5194935 | Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure | Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Sueo Kawai +2 more | 1993-03-16 |
| 5159434 | Semiconductor device having a particular chip pad structure | Ryuji Kohno, Asao Nishimura, Akihiro Yaguchi, Sueo Kawai | 1992-10-27 |
| 5101263 | Semiconductor device and method for manufacturing the same | Chikako Kitabayashi, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Sueo Kawai | 1992-03-31 |
| 5068712 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjo +19 more | 1991-11-26 |
| 5047837 | Semiconductor device with heat transfer cap | Takahiro Daikoku, Sueo Kawai, Ichio Shimizu, Kazuo Yamazaki, Asao Nishimura +2 more | 1991-09-10 |
| 5041901 | Lead frame and semiconductor device using the same | Asao Nishimura, Akihiro Yaguchi, Sueo Kawai, Akio Hoshi, Ichio Shimizu | 1991-08-20 |
| 4987474 | Semiconductor device and method of manufacturing the same | Toshihiro Yasuhara, Masachika Masuda, Asao Nishimura, Naozumi Hatada, Sueo Kawai +3 more | 1991-01-22 |
| 4942452 | Lead frame and semiconductor device | Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako Kitabayashi +5 more | 1990-07-17 |