Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10859625 | Wafer probe card integrated with a light source facing a device under test side and method of manufacturing | Lanxiang Wang, Meng Yew Seah, Shyue Seng Tan | 2020-12-08 |
| 10656362 | Gamma groove arrays for interconnecting and mounting devices | Yamin Huang, BO LIU, Zhihong Mai | 2020-05-19 |
| 10497820 | Wedge-shaped fiber array on a silicon-photonic device and method for producing the same | Dandan Wang, Lei Zhu, Zhihong Mai | 2019-12-03 |
| 10336608 | Methods for fabricating electronic devices including substantially hermetically sealed cavities and getter films | Szu Huat Goh, Edy Susanto | 2019-07-02 |
| 9964589 | System for detection of a photon emission generated by a device and methods for detecting the same | Lei Zhu, Pik Kee Tan, Zhihong Mai, Huei Hao Yap | 2018-05-08 |
| 9958502 | Defect isolation methods and systems | Szu Huat Goh, Yin Hong CHAN, Boon Lian Yeoh, Lin Zhao | 2018-05-01 |
| 9739831 | Defect isolation methods and systems | Szu Huat Goh, Yin Hong CHAN, Boon Lian Yeoh | 2017-08-22 |
| 9718672 | Electronic devices including substantially hermetically sealed cavities and getter films with Kelvin measurement arrangement for evaluating the getter films and methods for fabricating the same | Szu Huat Goh, Edy Susanto | 2017-08-01 |
| 9613874 | Methods for evaluating semiconductor device structures | Jie Zhu, Binghai Liu, Eddie Er, Si Ping Zhao | 2017-04-04 |
| 9601424 | Interposer and methods of forming and testing an interposer | Rahul Agarwal, Jens Oswald, Sheng-Feng Lu, Soon Leng Tan | 2017-03-21 |
| 9581506 | Methods for evaluating strain of crystalline devices | Jie Zhu, Binghai Liu, Eddie Er, Si Ping Zhao | 2017-02-28 |
| 9496187 | Setup for multiple cross-section sample preparation | Tsu Hau Ng, Zhihong Mai, Mohammed Khalid Bin Dawood, Pik Kee Tan, Yamin Huang | 2016-11-15 |
| 9128117 | Laser-enhanced chemical etching of nanotips | Zhihong Mai, Mohammed Khalid Bin Dawood, Tsu Hau Ng | 2015-09-08 |
| 8536705 | Integrated circuit system with through silicon via and method of manufacture thereof | Pradeep Ramachandramurthy Yelehanka, Denise Tan, Chung Meng Lek, Thomas Thiam, Liang-Choo Hsia | 2013-09-17 |
| 8489945 | Method and system for introducing physical damage into an integrated circuit device for verifying testing program and its results | Zhihong Mai, Pik Kee Tan, Guo Chang Man, Liang-Choo Hsia | 2013-07-16 |
| 8236688 | Integrated circuit system with through silicon via and method of manufacture thereof | Pradeep Ramachandramurthy Yelehanka, Denise Tan, Chung Meng Lek, Thomas Thiam, Liang-Choo Hsia | 2012-08-07 |
| 8158513 | Integrated circuit system employing backside energy source for electrical contact formation | Zhihong Mai, Suey Li Toh, Pik Kee Tan, Liang-Choo Hsia | 2012-04-17 |
| 7960282 | Method of manufacture an integrated circuit system with through silicon via | Pradeep Ramachandramurthy Yelehanka, Denise Tan, Chung Meng Lek, Thomas Thiam, Liang-Choo Hsia | 2011-06-14 |
| 7939348 | E-beam inspection structure for leakage analysis | Victor Lim | 2011-05-10 |
| 7323406 | Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures | Victor Lim, Fan Zhang | 2008-01-29 |