Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5789140 | Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue | Solomon I. Beilin, Wen-chou Vincent Wang | 1998-08-04 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, David Kudzuma, Michael G. Lee, Teruo Murase, Michael G. Peters +3 more | 1998-07-14 |
| 5773889 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1998-06-30 |
| 5746903 | Wet chemical processing techniques for plating high aspect ratio features | Solomon I. Beilin, Michael G. Lee, Wen-chou Vincent Wang | 1998-05-05 |
| 5722162 | Fabrication procedure for a stable post | Solomon I. Beilin, David A. Horine, David Kudzuma, Michael G. Lee, Larry L. Moresco +1 more | 1998-03-03 |
| 5660957 | Electron-beam treatment procedure for patterned mask layers | Solomon I. Beilin, David Kudzuma, Wen-chou Vincent Wang | 1997-08-26 |
| 5656414 | Methods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the like | Wen-chou Vincent Wang | 1997-08-12 |
| 5652693 | Substrate with thin film capacitor and insulating plug | Michael G. Peters, Wen-chou Vincent Wang, Richard L. Wheeler | 1997-07-29 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, David Kudzuma, Michael G. Lee, Teruo Murase, Michael G. Peters +3 more | 1996-08-06 |
| 5536362 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1996-07-16 |
| 5475262 | Functional substrates for packaging semiconductor chips | Wen-chou Vincent Wang | 1995-12-12 |
| 5458731 | Method for fast and non-destructive examination of etched features | James J. Roman | 1995-10-17 |
| 5455064 | Process for fabricating a substrate with thin film capacitor and insulating plug | Michael G. Peters, Wen-chou Vincent Wang, Richard L. Wheeler | 1995-10-03 |
| 5419038 | Method for fabricating thin-film interconnector | Wen-chou Vincent Wang, Solomon I. Beilin, David Kudzuma, Michael G. Lee, Michael G. Peters +2 more | 1995-05-30 |
| 5406446 | Thin film capacitor | Michael G. Peters, Wen-chou Vincent Wang, Michael G. Lee, Solomon I. Beilin | 1995-04-11 |
| 5382827 | Functional substrates for packaging semiconductor chips | Wen-chou Vincent Wang | 1995-01-17 |
| 5376586 | Method of curing thin films of organic dielectric material | Solomon I. Beilin, Wen-chou Vincent Wang | 1994-12-27 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, Larry L. Moresco, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |
| 5323520 | Process for fabricating a substrate with thin film capacitor | Michael G. Peters, Wen-chou Vincent Wang, Michael G. Lee, Solomon I. Beilin | 1994-06-28 |
| 5098625 | Process for forming an expanded porous tetrafluoroethylene polymer | James Huang, David Chou | 1992-03-24 |