Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257393 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Zhiwei Gong | 2016-02-09 |
| 9209081 | Semiconductor grid array package | Fui Yee Lim | 2015-12-08 |
| 9129981 | Methods for the production of microelectronic packages having radiofrequency stand-off layers | Eduard Jan Pabst | 2015-09-08 |
| 9123685 | Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof | Douglas G. Mitchell | 2015-09-01 |
| 9029202 | Method of forming a high thermal conducting semiconductor device package | Jinbang Tang | 2015-05-12 |
| 9024429 | Microelectronic packages containing opposing devices and methods for the fabrication thereof | — | 2015-05-05 |
| 9025340 | Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication | Jason Wright, Michael B. Vincent | 2015-05-05 |
| 9018045 | Microelectronic packages and methods for the fabrication thereof | Douglas G. Mitchell | 2015-04-28 |
| 8980696 | Method of packaging semiconductor die | Dominic Koey Poh Meng, Zhiwei Gong, Kesvakumar V. C. Muniandy | 2015-03-17 |
| 8963318 | Packaged semiconductor device | — | 2015-02-24 |
| 8927417 | Semiconductor package signal routing using conductive vias | — | 2015-01-06 |
| 8927345 | Device package with rigid interconnect structure connecting die and substrate and method thereof | Lai Cheng Law, Boh Kid Wong | 2015-01-06 |
| 8741666 | Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires | Lai Cheng Law, Boh Kid Wong | 2014-06-03 |
| 8680660 | Brace for bond wire | Lai Cheng Law, Boh Kid Wong | 2014-03-25 |