Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8927345 | Device package with rigid interconnect structure connecting die and substrate and method thereof | Weng F. Yap, Boh Kid Wong | 2015-01-06 |
| 8741666 | Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires | Weng F. Yap, Boh Kid Wong | 2014-06-03 |
| 8680660 | Brace for bond wire | Boh Kid Wong, Weng F. Yap | 2014-03-25 |