Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Lakshminarayan Viswanathan, Zhiwei Gong, Fernando A. Santos +1 more | 2024-12-31 |
| 11990384 | Amplifier modules with power transistor die and peripheral ground connections | Elie A. Maalouf | 2024-05-21 |
| 11329013 | Interconnected substrate arrays containing electrostatic discharge protection grids and associated microelectronic packages | James G. Cotronakis, Jose Luis Suarez | 2022-05-10 |
| 9589909 | Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers | Weng F. Yap | 2017-03-07 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more | 2016-11-22 |
| 9362234 | Shielded device packages having antennas and related fabrication methods | Sergio Pacheco, Weng F. Yap | 2016-06-07 |
| 9343414 | Microelectronic packages having radio frequency stand-off layers | Weng F. Yap | 2016-05-17 |
| 9129981 | Methods for the production of microelectronic packages having radiofrequency stand-off layers | Weng F. Yap | 2015-09-08 |