Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7276435 | Die level metal density gradient for improved flip chip package reliability | Scott K. Pozder, Kevin J. Hess, Ruiqi Tian, Edward O. Travis, Trent S. Uehling +1 more | 2007-10-02 |